Bob Shih-Wei Kuo

Person

Tucson, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through wafer via structures for concentrated photovoltaic cells
- Patent number 8,866,002
- Issue date Oct 21, 2014
- Amkor Technology, Inc.
- Garry Pycroft
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Edge mount semiconductor package
- Patent number 8,217,507
- Issue date Jul 10, 2012
- Amkor Technology, Inc.
- Jesse E. Galloway
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 8,115,283
- Issue date Feb 14, 2012
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 8,030,722
- Issue date Oct 4, 2011
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin substrate fabrication method and structure
- Patent number 8,017,436
- Issue date Sep 13, 2011
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to provide RF shielding for a MEMS microphone pac...
- Patent number 7,915,715
- Issue date Mar 29, 2011
- Amkor Technology, Inc.
- Nozad O. Karim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ultra thin package and fabrication method
- Patent number 7,842,541
- Issue date Nov 30, 2010
- Amkor Technology, Inc.
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blind via capture pad structure
- Patent number 7,750,250
- Issue date Jul 6, 2010
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level package utilizing laser-activated dielectric material
- Patent number 7,632,753
- Issue date Dec 15, 2009
- Amkor Technology, Inc.
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REVERSIBLE TOP/BOTTOM MEMS PACKAGE
- Publication number 20120104629
- Publication date May 3, 2012
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PAC...
- Publication number 20100127376
- Publication date May 27, 2010
- Nozad O. Karim
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bob Shih-Wei Kuo

Person

Patents Grantslast 30 patents

Through wafer via structures for concentrated photovoltaic cells

Edge mount semiconductor package

Reversible top/bottom MEMS package

Reversible top/bottom MEMS package

Thin substrate fabrication method and structure

System and method to provide RF shielding for a MEMS microphone pac...

Ultra thin package and fabrication method

Blind via capture pad structure

Wafer level package utilizing laser-activated dielectric material

Patents Applicationslast 30 patents

REVERSIBLE TOP/BOTTOM MEMS PACKAGE

SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PAC...