Bobby J. Self

Person

Colorado Springs, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density interconnect
- Patent number 7,094,063
- Issue date Aug 22, 2006
- Agilent Technologies, Inc.
- Bob J. Self
- G01 - MEASURING TESTING
Information Patent Grant
Probe for testing circuits, and associated methods
- Patent number 6,867,609
- Issue date Mar 15, 2005
- Agilent Technologies, Inc.
- Brent A. Holcombe
- G01 - MEASURING TESTING
Information Patent Grant
High density, high frequency, board edge probe
- Patent number 6,864,696
- Issue date Mar 8, 2005
- Agilent Technologies, Inc.
- Donald M. Logelin
- G01 - MEASURING TESTING
Information Patent Grant
Cam bumplett apparatus and system
- Patent number 6,846,194
- Issue date Jan 25, 2005
- Agilent Technologies, Inc.
- Bobby Joe Self
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder-down printed circuit board connection structure
- Patent number 6,783,371
- Issue date Aug 31, 2004
- Agilent Technologies, Inc.
- Bobby J Self
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete connector termination adapter
- Patent number 6,776,662
- Issue date Aug 17, 2004
- Agilent Technologies, Inc.
- Bob J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single point probe structure and method
- Patent number 6,768,328
- Issue date Jul 27, 2004
- Agilent Technologies, Inc.
- Bob J. Self
- G01 - MEASURING TESTING
Information Patent Grant
Heatsink with improved heat dissipation capability
- Patent number 6,735,082
- Issue date May 11, 2004
- Agilent Technologies, Inc.
- Bob J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector termination adapter
- Patent number 6,712,622
- Issue date Mar 30, 2004
- Agilent Technologies, Inc.
- Bob J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic shroud for use with board-mounted electronic connectors
- Patent number 6,508,660
- Issue date Jan 21, 2003
- Agilent Technologies, Inc.
- Bobby J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for interconnection of printed circuit boards
- Patent number 6,409,520
- Issue date Jun 25, 2002
- Agilent Technologies, Inc.
- Bobby J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perimeter trace probe for plastic ball grid arrays
- Patent number 6,064,214
- Issue date May 16, 2000
- Hewlett-Packard Company
- Bobby J. Self
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for connecting a ball grid array device to a t...
- Patent number 5,859,538
- Issue date Jan 12, 1999
- Hewlett-Packard Company
- Bob J. Self
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Methods Of Making A Interconnect
- Publication number 20060281342
- Publication date Dec 14, 2006
- Bob J. Self
- G01 - MEASURING TESTING
Information Patent Application
Connector-less probe
- Publication number 20040164754
- Publication date Aug 26, 2004
- Brent A. Holcombe
- G01 - MEASURING TESTING
Information Patent Application
Cam bumplett apparatus and system
- Publication number 20040102073
- Publication date May 27, 2004
- Bobby Joe Self
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High density, high frequency, board edge probe
- Publication number 20040085081
- Publication date May 6, 2004
- Donald M. Logelin
- G01 - MEASURING TESTING
Information Patent Application
Single point probe structure and method
- Publication number 20040070411
- Publication date Apr 15, 2004
- Bob J. Self
- G01 - MEASURING TESTING
Information Patent Application
CONNECTOR TERMINATION ADAPTER
- Publication number 20040063342
- Publication date Apr 1, 2004
- Bob J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Discrete connector termination adapter
- Publication number 20040063356
- Publication date Apr 1, 2004
- Bob J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density interconnect
- Publication number 20040043640
- Publication date Mar 4, 2004
- Bob J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK WITH IMPROVED HEAT DISSIPATION CAPABILITY
- Publication number 20040032718
- Publication date Feb 19, 2004
- Bob J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder-down printed circuit board connection structure
- Publication number 20020151193
- Publication date Oct 17, 2002
- Bobby J. Self
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic shroud for use with board-mounted electronic connectors
- Publication number 20020115333
- Publication date Aug 22, 2002
- Bobby J. Self
- H01 - BASIC ELECTRIC ELEMENTS

Bobby J. Self

Person

Patents Grantslast 30 patents

High density interconnect

Probe for testing circuits, and associated methods

High density, high frequency, board edge probe

Cam bumplett apparatus and system

Solder-down printed circuit board connection structure

Discrete connector termination adapter

Single point probe structure and method

Heatsink with improved heat dissipation capability

Connector termination adapter

Metallic shroud for use with board-mounted electronic connectors

Structure and method for interconnection of printed circuit boards

Perimeter trace probe for plastic ball grid arrays

Method and apparatus for connecting a ball grid array device to a t...

Patents Applicationslast 30 patents

Methods Of Making A Interconnect

Connector-less probe

Cam bumplett apparatus and system

High density, high frequency, board edge probe

Single point probe structure and method

CONNECTOR TERMINATION ADAPTER

Discrete connector termination adapter

High density interconnect

HEATSINK WITH IMPROVED HEAT DISSIPATION CAPABILITY

Solder-down printed circuit board connection structure

Metallic shroud for use with board-mounted electronic connectors