Bodan Ma

Person

Racine, WI, US

People

Patents Grantslast 30 patents

Information Patent Grant
B-stageable underfill encapsulant and method for its application
- Patent number 7,608,487
- Issue date Oct 27, 2009
- Henkel AG & Co.KGaA
- Allison Yue Xiao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfill encapsulant for wafer packaging and method for its applic...
- Patent number 7,037,399
- Issue date May 2, 2006
- National Starch and Chemical Investment Holding Corporation
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Dual cure B-stageable underfill for wafer level
- Patent number 6,833,629
- Issue date Dec 21, 2004
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Package encapsulant compositions for use in electronic devices
- Patent number 6,350,838
- Issue date Feb 26, 2002
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Package encapsulant compositions for use in electronic devices
- Patent number 6,316,566
- Issue date Nov 13, 2001
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Compositions for use in the fabrication of circuit components and p...
- Patent number 6,281,314
- Issue date Aug 28, 2001
- National Starch and Chemical Investment Holding Corporation
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of making an electronic component using reworkable underfill...
- Patent number 6,180,187
- Issue date Jan 30, 2001
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfill encapsulant compositions for use in electronic devices
- Patent number 6,063,828
- Issue date May 16, 2000
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of making an electronic component using reworkable underfill...
- Patent number 6,057,381
- Issue date May 2, 2000
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Underfill encapsulant for wafer packaging and method for its applic...
- Publication number 20030171456
- Publication date Sep 11, 2003
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
B-stageable underfill encapsulant and method for its application
- Publication number 20030164555
- Publication date Sep 4, 2003
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Dual cure B-stageable underfill for wafer level
- Publication number 20030141592
- Publication date Jul 31, 2003
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Package encapsulant compositions for use in electronic devices
- Publication number 20010056162
- Publication date Dec 27, 2001
- Bodan Ma
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

B-stageable underfill encapsulant and method for its application

Underfill encapsulant for wafer packaging and method for its applic...

Dual cure B-stageable underfill for wafer level

Package encapsulant compositions for use in electronic devices

Package encapsulant compositions for use in electronic devices

Compositions for use in the fabrication of circuit components and p...

Method of making an electronic component using reworkable underfill...

Underfill encapsulant compositions for use in electronic devices

Method of making an electronic component using reworkable underfill...

Patents Applicationslast 30 patents

Underfill encapsulant for wafer packaging and method for its applic...

B-stageable underfill encapsulant and method for its application

Dual cure B-stageable underfill for wafer level

Package encapsulant compositions for use in electronic devices