Bodin Kasemset

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Bangkok, TH

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Patents Grantslast 30 patents

Information Patent Grant
Inter-connection of a lead frame with a passive component intermedi...
- Patent number 10,727,168
- Issue date Jul 28, 2020
- NXP B.V.
- Bodin Kasemset
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module with filled contact gaps
- Patent number 9,595,455
- Issue date Mar 14, 2017
- NXP B.V.
- Bodin Kasemset
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual interface IC card components and method for manufacturing the...
- Patent number 9,424,507
- Issue date Aug 23, 2016
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC package with stainless steel leadframe
- Patent number 8,884,415
- Issue date Nov 11, 2014
- NXP B.V.
- Peeradech Khunpukdee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTER-CONNECTION OF A LEAD FRAME WITH A PASSIVE COMPONENT INTERMEDI...
- Publication number 20160079146
- Publication date Mar 17, 2016
- NXP B.V.
- Bodin Kasemset
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE...
- Publication number 20150278673
- Publication date Oct 1, 2015
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IC PACKAGE WITH STAINLESS STEEL LEADFRAME
- Publication number 20140239471
- Publication date Aug 28, 2014
- NXP B.V.
- Peeradech Khunpukdee
- H01 - BASIC ELECTRIC ELEMENTS