Boguslaw A. Swedek

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Core configuration for in-situ electromagnetic induction monitoring...
- Patent number 12,103,135
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Hassan G. Iravani
- B24 - GRINDING POLISHING
Information Patent Grant
Grouping spectral data from polishing substrates
- Patent number 11,774,235
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Jeffrey Drue David
- G01 - MEASURING TESTING
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 11,776,109
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Nojan Motamedi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Color imaging for CMP monitoring
- Patent number 11,715,193
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Endpoint detection for chemical mechanical polishing based on spect...
- Patent number 11,715,672
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Monitoring of vibrations during chemical mechanical polishing
- Patent number 11,701,749
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Boguslaw A. Swedek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging for monitoring thickness in a substrate cleaning system
- Patent number 11,699,595
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-toothed, magnetically controlled retaining ring
- Patent number 11,691,244
- Issue date Jul 4, 2023
- Applied Materials, Inc.
- Boguslaw A. Swedek
- B24 - GRINDING POLISHING
Information Patent Grant
Core configuration for in-situ electromagnetic induction monitoring...
- Patent number 11,638,982
- Issue date May 2, 2023
- Applied Materials, Inc.
- Hassan G. Iravani
- B24 - GRINDING POLISHING
Information Patent Grant
Machine vision as input to a CMP process control algorithm
- Patent number 11,577,356
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Benjamin Cherian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 11,557,048
- Issue date Jan 17, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Resistivity-based adjustment of measurements from in-situ monitoring
- Patent number 11,199,605
- Issue date Dec 14, 2021
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Endpointing detection for chemical mechanical polishing based on sp...
- Patent number 11,183,435
- Issue date Nov 23, 2021
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 11,100,628
- Issue date Aug 24, 2021
- Applied Materials, Inc.
- Nojan Motamedi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resistivity-based calibration of in-situ electromagnetic inductive...
- Patent number 11,079,459
- Issue date Aug 3, 2021
- Applied Materials, Inc.
- Kun Xu
- G01 - MEASURING TESTING
Information Patent Grant
Core configuration with alternating posts for in-situ electromagnet...
- Patent number 11,004,708
- Issue date May 11, 2021
- Applied Materials, Inc.
- Hassan G. Iravani
- G01 - MEASURING TESTING
Information Patent Grant
Polishing apparatus using neural network for monitoring
- Patent number 10,994,389
- Issue date May 4, 2021
- Applied Materials, Inc.
- Kun Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display of spectra contour plots versus time for semiconductor proc...
- Patent number 10,948,900
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Spectra based endpointing for chemical mechanical polishing
- Patent number 10,766,119
- Issue date Sep 8, 2020
- Applied Materials, Inc.
- Boguslaw A. Swedek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive monitoring of conductive loops
- Patent number 10,741,459
- Issue date Aug 11, 2020
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint control of multiple substrate zones of varying thickness i...
- Patent number 10,589,397
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Alain Duboust
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Color imaging for CMP monitoring
- Patent number 10,565,701
- Issue date Feb 18, 2020
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Determination of gain for eddy current sensor
- Patent number 10,556,315
- Issue date Feb 11, 2020
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Core configuration for in-situ electromagnetic induction monitoring...
- Patent number 10,391,610
- Issue date Aug 27, 2019
- Applied Materials, Inc.
- Hassan G. Iravani
- G01 - MEASURING TESTING
Information Patent Grant
Endpointing detection for chemical mechanical polishing based on sp...
- Patent number 10,276,460
- Issue date Apr 30, 2019
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Determination of gain for eddy current sensor
- Patent number 10,207,386
- Issue date Feb 19, 2019
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate features for inductive monitoring of conductive trench depth
- Patent number 10,199,281
- Issue date Feb 5, 2019
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eddy current system having an elongated core for in-situ profile me...
- Patent number 10,105,811
- Issue date Oct 23, 2018
- Applied Materials, Inc.
- G. Laurie Miller
- B24 - GRINDING POLISHING
Information Patent Grant
Inductive monitoring of conductive trench depth
- Patent number 10,103,073
- Issue date Oct 16, 2018
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Applying dimensional reduction to spectral data from polishing subs...
- Patent number 10,086,492
- Issue date Oct 2, 2018
- Applied Materials, Inc.
- Jeffrey Drue David
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING
- Publication number 20240017371
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER
- Publication number 20240017376
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
ACOUSTIC MONITORING OF CMP RETAINING RING
- Publication number 20230390883
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Haoquan Fang
- B24 - GRINDING POLISHING
Information Patent Application
CORE CONFIGURATION FOR IN-SITU ELECTROMAGNETIC INDUCTION MONITORING...
- Publication number 20230213324
- Publication date Jul 6, 2023
- Applied Materials, Inc.
- Hassan G. Iravani
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM
- Publication number 20230182258
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Benjamin Cherian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
USING LIGHT COUPLING PROPERTIES FOR FILM DETECTION
- Publication number 20220388111
- Publication date Dec 8, 2022
- Applied Materials, Inc.
- Nojan Motamedi
- B24 - GRINDING POLISHING
Information Patent Application
USING LIGHT COUPLING PROPERTIES FOR MACHINE-LEARNING-BASED FILM DET...
- Publication number 20220388112
- Publication date Dec 8, 2022
- Applied Materials, Inc.
- Nojan Motamedi
- B24 - GRINDING POLISHING
Information Patent Application
PASSIVE ACOUSTIC MONITORING AND ACOUSTIC SENSORS FOR CHEMICAL MECHA...
- Publication number 20220281057
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Application
ACTIVE ACOUSTIC MONITORING FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20220281058
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Application
IMAGING FOR MONITORING THICKNESS IN A SUBSTRATE CLEANING SYSTEM
- Publication number 20220270889
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B08 - CLEANING
Information Patent Application
ENDPOINT DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECT...
- Publication number 20220077006
- Publication date Mar 10, 2022
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVITY-BASED ADJUSTMENT OF THRESHOLDS FOR IN-SITU MONITORING
- Publication number 20220043095
- Publication date Feb 10, 2022
- Applied Materials, Inc.
- Kun Xu
- G01 - MEASURING TESTING
Information Patent Application
MULTI-TOOTHED, MAGNETICALLY CONTROLLED RETAINING RING
- Publication number 20220009053
- Publication date Jan 13, 2022
- Applied Materials, Inc.
- Boguslaw A. SWEDEK
- B24 - GRINDING POLISHING
Information Patent Application
Thickness Measurement of Substrate Using Color Metrology
- Publication number 20210358113
- Publication date Nov 18, 2021
- Applied Materials, Inc.
- Nojan Motamedi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLISHING APPARATUS USING NEURAL NETWORK FOR MONITORING
- Publication number 20210229234
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- Kun Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thickness Measurement of Substrate Using Color Metrology
- Publication number 20200258214
- Publication date Aug 13, 2020
- Applied Materials, Inc.
- Nojan Motamedi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COLOR IMAGING FOR CMP MONITORING
- Publication number 20200151868
- Publication date May 14, 2020
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM
- Publication number 20200094370
- Publication date Mar 26, 2020
- Applied Materials, Inc.
- Benjamin Cherian
- B24 - GRINDING POLISHING
Information Patent Application
CORE CONFIGURATION FOR IN-SITU ELECTROMAGNETIC INDUCTION MONITORING...
- Publication number 20190358770
- Publication date Nov 28, 2019
- Applied Materials, Inc.
- Hassan G. Iravani
- B24 - GRINDING POLISHING
Information Patent Application
Monitoring of Vibrations During Chemical Mechanical Polishing
- Publication number 20190283204
- Publication date Sep 19, 2019
- Applied Materials, Inc.
- Boguslaw A. Swedek
- B24 - GRINDING POLISHING
Information Patent Application
ENDPOINTING DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SP...
- Publication number 20190252274
- Publication date Aug 15, 2019
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Application
THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY
- Publication number 20190244374
- Publication date Aug 8, 2019
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR
- Publication number 20190134775
- Publication date May 9, 2019
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
INDUCTIVE MONITORING OF CONDUCTIVE LOOPS
- Publication number 20190035699
- Publication date Jan 31, 2019
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Application
Grouping Spectral Data From Polishing Substrates
- Publication number 20180321026
- Publication date Nov 8, 2018
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS USING NEURAL NETWORK FOR MONITORING
- Publication number 20180304435
- Publication date Oct 25, 2018
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
RESISTIVITY-BASED ADJUSTMENT OF MEASUREMENTS FROM IN-SITU MONITORING
- Publication number 20180203089
- Publication date Jul 19, 2018
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
RESISTIVITY-BASED CALIBRATION OF IN-SITU ELECTROMAGNETIC INDUCTIVE...
- Publication number 20180203090
- Publication date Jul 19, 2018
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20180166347
- Publication date Jun 14, 2018
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE CONFIGURATION WITH ALTERNATING POSTS FOR IN-SITU ELECTROMAGNET...
- Publication number 20180122667
- Publication date May 3, 2018
- Applied Materials, Inc.
- Hassan G. Iravani
- G01 - MEASURING TESTING

Boguslaw A. Swedek

Person

Patents Grantslast 30 patents

Core configuration for in-situ electromagnetic induction monitoring...

Grouping spectral data from polishing substrates

Thickness measurement of substrate using color metrology

Color imaging for CMP monitoring

Endpoint detection for chemical mechanical polishing based on spect...

Monitoring of vibrations during chemical mechanical polishing

Imaging for monitoring thickness in a substrate cleaning system

Multi-toothed, magnetically controlled retaining ring

Core configuration for in-situ electromagnetic induction monitoring...

Machine vision as input to a CMP process control algorithm

Thickness measurement of substrate using color metrology

Resistivity-based adjustment of measurements from in-situ monitoring

Endpointing detection for chemical mechanical polishing based on sp...

Thickness measurement of substrate using color metrology

Resistivity-based calibration of in-situ electromagnetic inductive...

Core configuration with alternating posts for in-situ electromagnet...

Polishing apparatus using neural network for monitoring

Display of spectra contour plots versus time for semiconductor proc...

Spectra based endpointing for chemical mechanical polishing

Inductive monitoring of conductive loops

Endpoint control of multiple substrate zones of varying thickness i...

Color imaging for CMP monitoring

Determination of gain for eddy current sensor

Core configuration for in-situ electromagnetic induction monitoring...

Endpointing detection for chemical mechanical polishing based on sp...

Determination of gain for eddy current sensor

Substrate features for inductive monitoring of conductive trench depth

Eddy current system having an elongated core for in-situ profile me...

Inductive monitoring of conductive trench depth

Applying dimensional reduction to spectral data from polishing subs...

Patents Applicationslast 30 patents

MONITORING THICKNESS IN FACE-UP POLISHING

MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER

ACOUSTIC MONITORING OF CMP RETAINING RING

CORE CONFIGURATION FOR IN-SITU ELECTROMAGNETIC INDUCTION MONITORING...

MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM

USING LIGHT COUPLING PROPERTIES FOR FILM DETECTION

USING LIGHT COUPLING PROPERTIES FOR MACHINE-LEARNING-BASED FILM DET...

PASSIVE ACOUSTIC MONITORING AND ACOUSTIC SENSORS FOR CHEMICAL MECHA...

ACTIVE ACOUSTIC MONITORING FOR CHEMICAL MECHANICAL POLISHING

IMAGING FOR MONITORING THICKNESS IN A SUBSTRATE CLEANING SYSTEM

ENDPOINT DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECT...

RESISTIVITY-BASED ADJUSTMENT OF THRESHOLDS FOR IN-SITU MONITORING

MULTI-TOOTHED, MAGNETICALLY CONTROLLED RETAINING RING

Thickness Measurement of Substrate Using Color Metrology

POLISHING APPARATUS USING NEURAL NETWORK FOR MONITORING

Thickness Measurement of Substrate Using Color Metrology

COLOR IMAGING FOR CMP MONITORING

MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM

CORE CONFIGURATION FOR IN-SITU ELECTROMAGNETIC INDUCTION MONITORING...

Monitoring of Vibrations During Chemical Mechanical Polishing

ENDPOINTING DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SP...

THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY

DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR

INDUCTIVE MONITORING OF CONDUCTIVE LOOPS

Grouping Spectral Data From Polishing Substrates

POLISHING APPARATUS USING NEURAL NETWORK FOR MONITORING

RESISTIVITY-BASED ADJUSTMENT OF MEASUREMENTS FROM IN-SITU MONITORING

RESISTIVITY-BASED CALIBRATION OF IN-SITU ELECTROMAGNETIC INDUCTIVE...

SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

CORE CONFIGURATION WITH ALTERNATING POSTS FOR IN-SITU ELECTROMAGNET...