Boh Kid Wong

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Ipoh, MY

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method employing two scrub settings
- Patent number 9,337,167
- Issue date May 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Boh Kid Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package with rigid interconnect structure connecting die and...
- Patent number 8,927,345
- Issue date Jan 6, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods relating to intermetallic testing of bond integrity between...
- Patent number 8,741,666
- Issue date Jun 3, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Weng F Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for bond wire
- Patent number 8,680,660
- Issue date Mar 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lai Cheng Law
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD EMPLOYING TWO SCRUB SETTINGS
- Publication number 20150279810
- Publication date Oct 1, 2015
- Boh Kid Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE WITH RIGID INTERCONNECT STRUCTURE CONNECTING DIE AND...
- Publication number 20140008811
- Publication date Jan 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS