Membership
Tour
Register
Log in
Bohan SHAN
Follow
Person
Tempe, AZ, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic structures including bridges
Patent number
12,119,326
Issue date
Oct 15, 2024
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selectively roughened copper architectures for low insertion loss c...
Patent number
12,033,930
Issue date
Jul 9, 2024
Intel Corporation
Jieying Kong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
Publication number
20250022786
Publication date
Jan 16, 2025
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...
Publication number
20250006645
Publication date
Jan 2, 2025
Intel Corporation
Xiao Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
2D FILLERS FOR REDUCED CTE FOR PID
Publication number
20240332125
Publication date
Oct 3, 2024
Intel Corporation
Kyle ARRINGTON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
Publication number
20240312865
Publication date
Sep 19, 2024
Intel Corporation
Kyle Arrington
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT RESPONSIVE PHOTORESISTS AND METHODS
Publication number
20240264530
Publication date
Aug 8, 2024
Intel Corporation
Ryan Carrazzone
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240219659
Publication date
Jul 4, 2024
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING
Publication number
20240222345
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...
Publication number
20240222243
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
Publication number
20240222259
Publication date
Jul 4, 2024
Intel Corporation
Haobo Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240219655
Publication date
Jul 4, 2024
Intel Corporation
Haobo Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240219660
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
G02 - OPTICS
Information
Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
Publication number
20240222301
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...
Publication number
20240222304
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL LAYER WITH ROUGHENED SURFACES
Publication number
20240222136
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES
Publication number
20240222257
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240219654
Publication date
Jul 4, 2024
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240219656
Publication date
Jul 4, 2024
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES
Publication number
20240222283
Publication date
Jul 4, 2024
Intel Corporation
Hongxia Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS SUBSTRATE FABRICATION USING HYBRID BONDING
Publication number
20240222210
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO RE...
Publication number
20240222238
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS
Publication number
20240213170
Publication date
Jun 27, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...
Publication number
20240213116
Publication date
Jun 27, 2024
Intel Corporation
Kyle Arrington
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY
Publication number
20240215269
Publication date
Jun 27, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD
Publication number
20240213169
Publication date
Jun 27, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA
Publication number
20240203806
Publication date
Jun 20, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRY FILM PHOTORESIST WET LAMINATION AND METHOD
Publication number
20240203853
Publication date
Jun 20, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
Publication number
20240186228
Publication date
Jun 6, 2024
Intel Corporation
Haobo Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
Publication number
20240186227
Publication date
Jun 6, 2024
Intel Corporation
Haobo Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240112971
Publication date
Apr 4, 2024
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES
Publication number
20240071848
Publication date
Feb 29, 2024
Intel Corporation
Bohan SHAN
H01 - BASIC ELECTRIC ELEMENTS