Bohan YAN

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) packages employing a thermal conductive pac...
- Patent number 11,437,335
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal release interposer
- Patent number 10,679,919
- Issue date Jun 9, 2020
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A THERMAL CONDUCTIVE PAC...
- Publication number 20210242160
- Publication date Aug 5, 2021
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL RELEASE INTERPOSER
- Publication number 20190393120
- Publication date Dec 26, 2019
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS