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Icheon-Si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
System and method for directional grinding on backside of a semicon...
Patent number
8,994,196
Issue date
Mar 31, 2015
STATS ChipPAC, Ltd.
SungYoon Lee
B24 - GRINDING POLISHING
Information
Patent Grant
Integrated circuit package system with support structure under wire...
Patent number
8,035,211
Issue date
Oct 11, 2011
Stats Chippac Ltd.
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for directional grinding on backside of a semiconductor wafer
Patent number
7,892,072
Issue date
Feb 22, 2011
STATS ChipPAC, Ltd.
SungYoon Lee
B24 - GRINDING POLISHING
Information
Patent Grant
Integrated circuit system with a debris trapping system
Patent number
7,659,140
Issue date
Feb 9, 2010
Stats Chippac Ltd.
Taewoo Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
System and Method for Directional Grinding on Backside of a Semicon...
Publication number
20110101546
Publication date
May 5, 2011
STATS ChipPAC, Ltd.
SungYoon Lee
B24 - GRINDING POLISHING
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE...
Publication number
20090243070
Publication date
Oct 1, 2009
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System and Method for Directional Grinding on Backside of a Semicon...
Publication number
20090068933
Publication date
Mar 12, 2009
STATS ChipPAC, Ltd.
SungYoon Lee
B24 - GRINDING POLISHING
Information
Patent Application
INTEGRATED CIRCUIT SYSTEM WITH A DEBRIS TRAPPING SYSTEM
Publication number
20080242053
Publication date
Oct 2, 2008
Taewoo Lee
H01 - BASIC ELECTRIC ELEMENTS