Bok Kyu CHOI

Person

Yongin-si Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,901,345
- Issue date Feb 13, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package including core die stacked over a controller die
- Patent number 11,798,917
- Issue date Oct 24, 2023
- SK hynix Inc.
- Bok Kyu Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Storage system including a decoupling device having a plurality of...
- Patent number 11,764,144
- Issue date Sep 19, 2023
- SK hynix Inc.
- Bok Kyu Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,637,089
- Issue date Apr 25, 2023
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,600,600
- Issue date Mar 7, 2023
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including penetrating electrodes, and semiconduc...
- Patent number 11,515,254
- Issue date Nov 29, 2022
- SK hynix Inc.
- Ki Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including stack modules comprised of interpo...
- Patent number 11,430,763
- Issue date Aug 30, 2022
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including through mold via structures
- Patent number 11,342,315
- Issue date May 24, 2022
- SK Hynix Inc.
- Juil Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system including a decoupling device having a plurality of...
- Patent number 11,264,319
- Issue date Mar 1, 2022
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,222,872
- Issue date Jan 11, 2022
- SK hynix Inc.
- Chae-Sung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages with interposer bridge
- Patent number 11,217,564
- Issue date Jan 4, 2022
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including an interconnection structure
- Patent number 11,205,638
- Issue date Dec 21, 2021
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including stacked sub-packages with interpos...
- Patent number 11,201,140
- Issue date Dec 14, 2021
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including modules stacked with interposing b...
- Patent number 11,127,687
- Issue date Sep 21, 2021
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including vertically stacked sub-packages with inter...
- Patent number 11,127,722
- Issue date Sep 21, 2021
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package having heat dissipation structure
- Patent number 11,114,362
- Issue date Sep 7, 2021
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages configured for measuring contact resistances...
- Patent number 11,018,094
- Issue date May 25, 2021
- SK hynix Inc.
- Ki Yong Lee
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor packages including bridge die
- Patent number 10,991,640
- Issue date Apr 27, 2021
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including a bridge die
- Patent number 10,957,627
- Issue date Mar 23, 2021
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having EMI shielding layers
- Patent number 10,923,434
- Issue date Feb 16, 2021
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including through mold vias
- Patent number 10,665,570
- Issue date May 26, 2020
- SK hynix Inc.
- Juil Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with band stop filter and semiconductor package i...
- Patent number 9,231,286
- Issue date Jan 5, 2016
- SK Hynix Inc.
- Byung Jun Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACK PACKAGE INCLUDING CORE DIE STACKED OVER A CONTROLLER DIE
- Publication number 20240030191
- Publication date Jan 25, 2024
- SK HYNIX INC.
- Bok Kyu CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
STORAGE SYSTEM INCLUDING A DECOUPLING DEVICE HAVING A PLURALITY OF...
- Publication number 20230386995
- Publication date Nov 30, 2023
- SK HYNIX INC.
- Bok Kyu CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230017863
- Publication date Jan 19, 2023
- SK HYNIX INC.
- Jeong Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220254756
- Publication date Aug 11, 2022
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE SYSTEM INCLUDING A DECOUPLING DEVICE HAVING A PLURALITY OF...
- Publication number 20220173030
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Bok Kyu CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220068884
- Publication date Mar 3, 2022
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE SYSTEM INCLUDING A DECOUPLING DEVICE HAVING A PLURALITY OF...
- Publication number 20220059452
- Publication date Feb 24, 2022
- SK HYNIX INC.
- Bok Kyu CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING PENETRATING ELECTRODES, AND SEMICONDUC...
- Publication number 20220020690
- Publication date Jan 20, 2022
- SK HYNIX INC.
- Ki Bum KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE INCLUDING CORE DIE STACKED OVER A CONTROLLER DIE
- Publication number 20210366874
- Publication date Nov 25, 2021
- SK HYNIX INC.
- Bok Kyu CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING STACK MODULES COMPRISED OF INTERPO...
- Publication number 20210265307
- Publication date Aug 26, 2021
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING MODULES STACKED WITH INTERPOSING B...
- Publication number 20210217700
- Publication date Jul 15, 2021
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING STACKED SUB-PACKAGES WITH INTERPOS...
- Publication number 20210193622
- Publication date Jun 24, 2021
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING VERTICALLY STACKED SUB-PACKAGES WITH INTER...
- Publication number 20210175218
- Publication date Jun 10, 2021
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES WITH INTERPOSER BRIDGE
- Publication number 20210143128
- Publication date May 13, 2021
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20210074679
- Publication date Mar 11, 2021
- SK HYNIX INC.
- Chae-Sung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE HAVING HEAT DISSIPATION STRUCTURE
- Publication number 20210005527
- Publication date Jan 7, 2021
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING AN INTERCONNECTION STRUCTURE
- Publication number 20200381399
- Publication date Dec 3, 2020
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A BRIDGE DIE
- Publication number 20200294889
- Publication date Sep 17, 2020
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING BRIDGE DIE
- Publication number 20200243422
- Publication date Jul 30, 2020
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES CONFIGURED FOR MEASURING CONTACT RESISTANCES...
- Publication number 20200191860
- Publication date Jun 18, 2020
- SK HYNIX INC.
- Ki Yong LEE
- G01 - MEASURING TESTING
Information Patent Application
STACK PACKAGES INCLUDING THROUGH MOLD VIAS
- Publication number 20190333894
- Publication date Oct 31, 2019
- SK HYNIX INC.
- Juil EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING THROUGH MOLD VIA STRUCTURES
- Publication number 20190333899
- Publication date Oct 31, 2019
- SK HYNIX INC.
- Juil EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING EMI SHIELDING LAYERS
- Publication number 20190333865
- Publication date Oct 31, 2019
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH SIGNAL TRANSMISSION PATHS RELATING TO PARAS...
- Publication number 20190080999
- Publication date Mar 14, 2019
- SK HYNIX INC.
- Juil EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH BAND STOP FILTER AND SEMICONDUCTOR PACKAGE I...
- Publication number 20140176262
- Publication date Jun 26, 2014
- Byung Jun BANG
- H01 - BASIC ELECTRIC ELEMENTS

Bok Kyu CHOI

Person

Patents Grantslast 30 patents

Semiconductor package

Stack package including core die stacked over a controller die

Storage system including a decoupling device having a plurality of...

Semiconductor package including stacked semiconductor chips

Semiconductor package including stacked semiconductor chips

Semiconductor chip including penetrating electrodes, and semiconduc...

Semiconductor packages including stack modules comprised of interpo...

Stack packages including through mold via structures

Storage system including a decoupling device having a plurality of...

Semiconductor package including stacked semiconductor chips

Stack packages with interposer bridge

Stack packages including an interconnection structure

Semiconductor packages including stacked sub-packages with interpos...

Semiconductor packages including modules stacked with interposing b...

Stack packages including vertically stacked sub-packages with inter...

Stacked semiconductor package having heat dissipation structure

Semiconductor packages configured for measuring contact resistances...

Semiconductor packages including bridge die

Semiconductor packages including a bridge die

Semiconductor packages having EMI shielding layers

Stack packages including through mold vias

Package substrate with band stop filter and semiconductor package i...

Patents Applicationslast 30 patents

STACK PACKAGE INCLUDING CORE DIE STACKED OVER A CONTROLLER DIE

STORAGE SYSTEM INCLUDING A DECOUPLING DEVICE HAVING A PLURALITY OF...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

STORAGE SYSTEM INCLUDING A DECOUPLING DEVICE HAVING A PLURALITY OF...

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

STORAGE SYSTEM INCLUDING A DECOUPLING DEVICE HAVING A PLURALITY OF...

SEMICONDUCTOR CHIP INCLUDING PENETRATING ELECTRODES, AND SEMICONDUC...

STACK PACKAGE INCLUDING CORE DIE STACKED OVER A CONTROLLER DIE

SEMICONDUCTOR PACKAGES INCLUDING STACK MODULES COMPRISED OF INTERPO...

SEMICONDUCTOR PACKAGES INCLUDING MODULES STACKED WITH INTERPOSING B...

SEMICONDUCTOR PACKAGES INCLUDING STACKED SUB-PACKAGES WITH INTERPOS...

STACK PACKAGES INCLUDING VERTICALLY STACKED SUB-PACKAGES WITH INTER...

STACK PACKAGES WITH INTERPOSER BRIDGE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

STACKED SEMICONDUCTOR PACKAGE HAVING HEAT DISSIPATION STRUCTURE

STACK PACKAGES INCLUDING AN INTERCONNECTION STRUCTURE

SEMICONDUCTOR PACKAGES INCLUDING A BRIDGE DIE

SEMICONDUCTOR PACKAGES INCLUDING BRIDGE DIE

SEMICONDUCTOR PACKAGES CONFIGURED FOR MEASURING CONTACT RESISTANCES...

STACK PACKAGES INCLUDING THROUGH MOLD VIAS

STACK PACKAGES INCLUDING THROUGH MOLD VIA STRUCTURES

SEMICONDUCTOR PACKAGES HAVING EMI SHIELDING LAYERS

PACKAGE SUBSTRATES WITH SIGNAL TRANSMISSION PATHS RELATING TO PARAS...

PACKAGE SUBSTRATE WITH BAND STOP FILTER AND SEMICONDUCTOR PACKAGE I...