Bok Leng Ser

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer structure for a semiconductor device and a method of for...
- Patent number 9,806,013
- Issue date Oct 31, 2017
- Institute of Technical Education
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic components
- Patent number 9,418,872
- Issue date Aug 16, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,698,295
- Issue date Apr 15, 2014
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,304,894
- Issue date Nov 6, 2012
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,884,007
- Issue date Feb 8, 2011
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,579,681
- Issue date Aug 25, 2009
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,368,374
- Issue date May 6, 2008
- Micron Technology Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density single inline memory module
- Patent number 5,956,233
- Issue date Sep 21, 1999
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD OF FOR...
- Publication number 20160211206
- Publication date Jul 21, 2016
- Institute of Technical Education
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENTS
- Publication number 20140141544
- Publication date May 22, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frames, microelectronic devices with lead frames, and methods...
- Publication number 20080006940
- Publication date Jan 10, 2008
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super High Density Module with Integrated Wafer Level Packages
- Publication number 20070264751
- Publication date Nov 15, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070152327
- Publication date Jul 5, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070145558
- Publication date Jun 28, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20050048695
- Publication date Mar 3, 2005
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20030227079
- Publication date Dec 11, 2003
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS

Bok Leng Ser

Person

Patents Grantslast 30 patents

Multilayer structure for a semiconductor device and a method of for...

Packaged microelectronic components

Super high-density module with integrated wafer level packages

Super high-density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

High density single inline memory module

Patents Applicationslast 30 patents

MULTILAYER STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD OF FOR...

PACKAGED MICROELECTRONIC COMPONENTS

Lead frames, microelectronic devices with lead frames, and methods...

Super High Density Module with Integrated Wafer Level Packages

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages