BoLee LIM

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Incheon, KR

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Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming SIP Module Absent Substrate
- Publication number 20230352316
- Publication date Nov 2, 2023
- STATS ChipPAC Pte Ltd.
- JiEun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STENCIL MASK AND STENCIL PRINTING METHOD
- Publication number 20230337369
- Publication date Oct 19, 2023
- STATS ChipPAC Pte Ltd.
- KyoWang KOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR