BongJin SON

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device including a through-via structure
- Patent number 12,062,594
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Bongjin Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 10,950,521
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 10,431,522
- Issue date Oct 1, 2019
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Equipment for manufacturing semiconductor devices and method for us...
- Patent number 10,319,619
- Issue date Jun 11, 2019
- Samsung Electronics Co., Ltd.
- BongJin Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 9,899,294
- Issue date Feb 20, 2018
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240222409
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Bongjin SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A THROUGH-VIA STRUCTURE
- Publication number 20220406688
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Bongjin SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220115426
- Publication date Apr 14, 2022
- Samsung Electronics Co., Ltd.
- Bongjin SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20200006188
- Publication date Jan 2, 2020
- SAMSUNG ELECTRONICS CO., LTD.
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20180145006
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD FOR US...
- Publication number 20170263596
- Publication date Sep 14, 2017
- Samsung Electronics Co., LTD
- BongJin SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20160190035
- Publication date Jun 30, 2016
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS

BongJin SON

Person

Patents Grantslast 30 patents

Integrated circuit device including a through-via structure

Thermal interface material layer and package-on-package device incl...

Thermal interface material layer and package-on-package device incl...

Equipment for manufacturing semiconductor devices and method for us...

Thermal interface material layer and package-on-package device incl...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTEGRATED CIRCUIT DEVICE INCLUDING A THROUGH-VIA STRUCTURE

IMAGE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD FOR US...

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...