TREA

Bongju Cho

Follow

Person

  • Suwon-si, KR
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 12,119,305
    • Issue date Oct 15, 2024
    • Samsung Electronics Co., Ltd.
    • Kyungdon Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,057,380
    • Issue date Aug 6, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,046,562
    • Issue date Jul 23, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,021,020
    • Issue date Jun 25, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,935,847
    • Issue date Mar 19, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out semiconductor package
    • Patent number 11,837,537
    • Issue date Dec 5, 2023
    • Samsung Electronics Co., Ltd.
    • Bongju Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out type semiconductor package
    • Patent number 11,721,620
    • Issue date Aug 8, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,569,175
    • Issue date Jan 31, 2023
    • Samsung Electronics Co., Ltd.
    • Kyungdon Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,569,158
    • Issue date Jan 31, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,562,966
    • Issue date Jan 24, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package having core member and redistribution substrate
    • Patent number 11,398,420
    • Issue date Jul 26, 2022
    • Samsung Electronics Co., Ltd.
    • Kyungdon Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,329,014
    • Issue date May 10, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out semiconductor package
    • Patent number 11,121,079
    • Issue date Sep 14, 2021
    • Samsung Electronics Co., Ltd.
    • Bongju Cho
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240347468
    • Publication date Oct 17, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240321728
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20230197596
    • Publication date Jun 22, 2023
    • Samsung Electronics Co., Ltd.
    • Jeongseok KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230178492
    • Publication date Jun 8, 2023
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230154836
    • Publication date May 18, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230144454
    • Publication date May 11, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES HAVING WIRING PATTERNS
    • Publication number 20230131240
    • Publication date Apr 27, 2023
    • Samsung Electronics Co., Ltd.
    • Youngchan KO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
    • Publication number 20230038413
    • Publication date Feb 9, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220367327
    • Publication date Nov 17, 2022
    • Samsung Electronics Co., Ltd.
    • MYUNGSAM KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220262748
    • Publication date Aug 18, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT TYPE SEMICONDUCTOR PACKAGE
    • Publication number 20220068784
    • Publication date Mar 3, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220068822
    • Publication date Mar 3, 2022
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220059440
    • Publication date Feb 24, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220013465
    • Publication date Jan 13, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220013454
    • Publication date Jan 13, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT SEMICONDUCTOR PACKAGE
    • Publication number 20210375757
    • Publication date Dec 2, 2021
    • Samsung Electronics Co., Ltd.
    • Bongju Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210265251
    • Publication date Aug 26, 2021
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20200312797
    • Publication date Oct 1, 2020
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT SEMICONDUCTOR PACKAGE
    • Publication number 20200161237
    • Publication date May 21, 2020
    • Samsung Electronics Co., Ltd.
    • Bongju Cho
    • H01 - BASIC ELECTRIC ELEMENTS