Bongken YU

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,996,387
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 11,961,795
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 11,676,890
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,257,784
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having solder terminals spaced apart from mol...
- Patent number 9,041,200
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP BONDING DEVICE
- Publication number 20240404985
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- BONGKEN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240290751
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHING APPARATUS
- Publication number 20240071983
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME
- Publication number 20230275014
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220157776
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME
- Publication number 20220020676
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210082872
- Publication date Mar 18, 2021
- SAMSUNG ELECTRONICS CO., LTD.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SOLDER TERMINALS SPACED APART FROM MOL...
- Publication number 20140353821
- Publication date Dec 4, 2014
- Bongken YU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package and package-on-package including the same

Semiconductor package and package-on-package including the same

Semiconductor package

Semiconductor devices having solder terminals spaced apart from mol...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP BONDING DEVICE

SEMICONDUCTOR PACKAGE

SOLDER BALL ATTACHING APPARATUS

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES HAVING SOLDER TERMINALS SPACED APART FROM MOL...