Bongsoo Kim

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board including conductive pad and electric device...
- Patent number 12,232,259
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory devices
- Patent number 11,968,824
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor and manufacturing method of the same
- Patent number 11,917,815
- Issue date Feb 27, 2024
- Samsung Electronics Co., Ltd.
- Hyosub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package
- Patent number 11,887,971
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,735,532
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,678,478
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,616,066
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Hyosub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package
- Patent number 11,393,793
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,355,445
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,264,392
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 11,183,500
- Issue date Nov 23, 2021
- Samsung Electronics Co., Ltd.
- Hoju Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor and manufacturing method of the same
- Patent number 11,088,143
- Issue date Aug 10, 2021
- Samsung Electronics Co., Ltd.
- Hyosub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a recessed active region, and metho...
- Patent number 9,209,241
- Issue date Dec 8, 2015
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240365535
- Publication date Oct 31, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Jongmin KIM
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290868
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Taejin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240130112
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Taejin PARK
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240105790
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Joonsoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240030314
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Seungmin SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20240032280
- Publication date Jan 25, 2024
- SAMSUNG ELECTEONICS CO., LTD.
- Taejin PARK
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20230402518
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Taejin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230255021
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230232618
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Hyosub Kim
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING CONDUCTIVE PAD AND ELECTRIC DEVICE...
- Publication number 20230199953
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- Bongsoo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN SEMICONDUCTOR PACKAGE
- Publication number 20220352125
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- BONGSOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220278049
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SSEMICONDUCTOR DEVICES
- Publication number 20220254787
- Publication date Aug 11, 2022
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220052057
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- Hoju Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210351184
- Publication date Nov 11, 2021
- Samsung Electronics Co., Ltd.
- Hyosub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE
- Publication number 20210210465
- Publication date Jul 8, 2021
- Samsung Electronics Co., Ltd.
- BONGSOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210202397
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210066305
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Hyosub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210035983
- Publication date Feb 4, 2021
- Samsung Electronics Co., Ltd.
- Hoju Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20200402981
- Publication date Dec 24, 2020
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A RECESSED ACTIVE REGION, AND METHO...
- Publication number 20140117492
- Publication date May 1, 2014
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICES WITH BURIED GATE ELECTRODES...
- Publication number 20120273791
- Publication date Nov 1, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICES WITH BURIED GATE ELECTRODES...
- Publication number 20110171800
- Publication date Jul 14, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Bongsoo Kim

Person

Patents Grantslast 30 patents

Printed circuit board including conductive pad and electric device...

Semiconductor memory devices

Semiconductor and manufacturing method of the same

Thin semiconductor package

Semiconductor packages

Semiconductor devices

Semiconductor device and manufacturing method of the same

Thin semiconductor package

Semiconductor packages

Semiconductor devices

Semiconductor memory device and method of manufacturing the same

Semiconductor and manufacturing method of the same

Semiconductor devices including a recessed active region, and metho...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICES

SEMICONDUCTOR AND MANUFACTURING METHOD OF THE SAME

PRINTED CIRCUIT BOARD INCLUDING CONDUCTIVE PAD AND ELECTRIC DEVICE...

THIN SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SSEMICONDUCTOR DEVICES

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

THIN SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES INCLUDING A RECESSED ACTIVE REGION, AND METHO...

METHOD OF FORMING SEMICONDUCTOR DEVICES WITH BURIED GATE ELECTRODES...

METHOD OF FORMING SEMICONDUCTOR DEVICES WITH BURIED GATE ELECTRODES...