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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including a dualized signal wiring structure
- Patent number 12,224,260
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Heejung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290738
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Bongwee YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20240282672
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- BONGWEE YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240234254
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Bongwee YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136255
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Bongwee YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON CHIP AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20220293514
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- Bongwee YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUALIZED SIGNAL WIRING STRUCTURE
- Publication number 20220181288
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Heejung CHOI
- H01 - BASIC ELECTRIC ELEMENTS