Boon Huat Lim

Person

Johor, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Method of electrically isolating shared leads of a lead frame strip
- Patent number 9,324,642
- Issue date Apr 26, 2016
- Infineon Technologies AG
- Frank Püschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of packaging a semiconductor device...
- Patent number 8,637,977
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of packaging a semiconductor device...
- Patent number 8,486,757
- Issue date Jul 16, 2013
- Infineon Technologies AG
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package with mold lock opening
- Patent number 8,466,009
- Issue date Jun 18, 2013
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having profiled elements extending from planar su...
- Patent number 8,030,742
- Issue date Oct 4, 2011
- Infineon Technologies
- Boon Kian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with mold lock vent
- Patent number 7,732,937
- Issue date Jun 8, 2010
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device package
- Patent number 6,588,098
- Issue date Jul 8, 2003
- Semiconductor Components Industries LLC
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for forming same
- Patent number 6,376,266
- Issue date Apr 23, 2002
- Semiconductor Components Industries LLC
- James Price Letterman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Electrically Isolating Shared Leads of a Lead Frame Strip
- Publication number 20150130037
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Frank Püschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...
- Publication number 20130285249
- Publication date Oct 31, 2013
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...
- Publication number 20110121461
- Publication date May 26, 2011
- INFINEON TECHNOLOGIES AG
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE WITH MOLD LOCK OPENING
- Publication number 20100227436
- Publication date Sep 9, 2010
- INFINEON TECHNOLOGIES AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MOLD LOCK VENT
- Publication number 20090224382
- Publication date Sep 10, 2009
- INFINEON TECHNOLOGIES AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20090140403
- Publication date Jun 4, 2009
- INFINEON TECHNOLOGIES AG
- Boon Kian Lim
- H01 - BASIC ELECTRIC ELEMENTS

Boon Huat Lim

Person

Patents Grantslast 30 patents

Method of electrically isolating shared leads of a lead frame strip

Semiconductor device and method of packaging a semiconductor device...

Semiconductor device and method of packaging a semiconductor device...

Method of fabricating a semiconductor package with mold lock opening

Electronic device having profiled elements extending from planar su...

Semiconductor package with mold lock vent

Method for manufacturing an electronic device package

Semiconductor package and method for forming same

Patents Applicationslast 30 patents

Method of Electrically Isolating Shared Leads of a Lead Frame Strip

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE WITH MOLD LOCK OPENING

SEMICONDUCTOR PACKAGE WITH MOLD LOCK VENT

ELECTRONIC DEVICE