Boon Teik Tee

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Taiping Perak, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
- Patent number 10,957,633
- Issue date Mar 23, 2021
- Infineon Technologies AG
- Boon Teik Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
- Patent number 10,438,870
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Boon Teik Tee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lead frame strip with molding compound channels
- Patent number 9,659,843
- Issue date May 23, 2017
- Infineon Technologies AG
- Boon Teik Tee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Packaging Assembly, Lead Frame Strip and Unit...
- Publication number 20190333842
- Publication date Oct 31, 2019
- Boon Teik Tee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor Device Packaging Assembly, Lead Frame Strip and Unit...
- Publication number 20170221802
- Publication date Aug 3, 2017
- INFINEON TECHNOLOGIES AG
- Boon Teik Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME STRIP WITH MOLDING COMPOUND CHANNELS
- Publication number 20160126163
- Publication date May 5, 2016
- Boon Teik Tee
- H01 - BASIC ELECTRIC ELEMENTS