Boon Wong

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Torrance, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a soldered electrical connection
- Patent number 6,742,248
- Issue date Jun 1, 2004
- The Boeing Company
- Boon Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making lightweight, low thermal expansion microwave struc...
- Patent number 5,871,684
- Issue date Feb 16, 1999
- Hughes Electronics Corporation
- Tzu Guu Teng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metallized ceramic substrate and its use in forming a reliable, lon...
- Publication number 20020166230
- Publication date Nov 14, 2002
- Boon Wong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC