TREA

Boping Wu

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  • Seattle, WA, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Electrical Devices and Methods for Forming Electrical Devices
    • Publication number 20190074252
    • Publication date Mar 7, 2019
    • Intel Corporation
    • Sruti Chigullapalli
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DECOUPLING ARRANGEMENT
    • Publication number 20180270948
    • Publication date Sep 20, 2018
    • Intel Corporation
    • William L. Barber
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ABSORBING TERMINATION IN AN INTERCONNECT
    • Publication number 20170006698
    • Publication date Jan 5, 2017
    • Intel Corporation
    • Shaowu Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DECOUPLING ARRANGEMENT
    • Publication number 20160309580
    • Publication date Oct 20, 2016
    • Intel Corporation
    • William L. Barber
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ABSORBING TERMINATION IN AN INTERCONNECT
    • Publication number 20160057851
    • Publication date Feb 25, 2016
    • Intel Corporation
    • Shaowu Huang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    DECOUPLING ARRANGEMENT
    • Publication number 20150131190
    • Publication date May 14, 2015
    • William L. Barber
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    DECOUPLING ARRANGEMENT
    • Publication number 20130157482
    • Publication date Jun 20, 2013
    • William L. Barber
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    Micro-via structure design for high performance integrated circuits
    • Publication number 20080079139
    • Publication date Apr 3, 2008
    • Chunfei Ye
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR