Bor-Ping Jang

Person

Chu-Bei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for thinning wafer thereof
- Patent number 11,721,555
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer level transfer molding and apparatus for performing the same
- Patent number 11,390,000
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mechanisms for forming bonding structures
- Patent number 11,233,032
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package structure
- Patent number 11,139,177
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,094,561
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level underfill and over-molding
- Patent number 11,024,618
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 10,985,135
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a boundary structure, a package on pack...
- Patent number 10,804,234
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer device and manufacturing method thereof
- Patent number 10,770,331
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Bor-Ping Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for thinning wafer thereof
- Patent number 10,727,074
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Ling Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure for semiconductor package and method of fabr...
- Patent number 10,679,866
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level transfer molding and apparatus for performing the same
- Patent number 10,513,070
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 10,510,712
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming bonding structures
- Patent number 10,504,870
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a boundary structure, a package on pack...
- Patent number 10,276,531
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 10,157,881
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package process for applying molding compound
- Patent number 10,134,703
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer device and manufacturing method thereof
- Patent number 10,056,285
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Bor-Ping Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level molding chase design
- Patent number 10,020,211
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer-level underfill and over-molding
- Patent number 9,893,044
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor wafer device and manufacturing method thereof
- Patent number 9,812,346
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Bor-Ping Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level transfer molding and apparatus for performing the same
- Patent number 9,802,349
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mechanisms for forming bonding structures
- Patent number 9,768,142
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative multi-purpose dipping plate
- Patent number 9,700,950
- Issue date Jul 11, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bor-Ping Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a boundary structure, a package on pack...
- Patent number 9,659,891
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 9,484,226
- Issue date Nov 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer device
- Patent number 9,236,351
- Issue date Jan 12, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Bor-Ping Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for thinning wafer thereof
- Patent number 9,129,899
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 9,093,337
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for manufacturing semiconductor device
- Patent number 9,085,049
- Issue date Jul 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR THINNING WAFER THEREOF
- Publication number 20200357651
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Ling HWANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200303214
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200303213
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20200118969
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Transfer Molding and Apparatus for Performing the Same
- Publication number 20200114556
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Mechanisms for Forming Bonding Structures
- Publication number 20200105710
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...
- Publication number 20190237422
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20190123018
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180358255
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- BOR-PING JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer-Level Underfill and Over-Molding
- Publication number 20180175013
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047611
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- BOR-PING JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Level Transfer Molding and Apparatus for Performing the Same
- Publication number 20180043593
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Mechanisms For Forming Bonding Structures
- Publication number 20180005976
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...
- Publication number 20170256513
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20170032980
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF FABR...
- Publication number 20160240451
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160099165
- Publication date Apr 7, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- BOR-PING JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THINNING WAFER THEREOF
- Publication number 20150371860
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL MOLDING CHASE DESIGN
- Publication number 20150364456
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20150262845
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Underfill and Over-Molding
- Publication number 20150130111
- Publication date May 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150097272
- Publication date Apr 9, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- BOR-PING JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20150093858
- Publication date Apr 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...
- Publication number 20150069604
- Publication date Mar 12, 2015
- TAIWAN SEMICODUCTOR MANUFACTURING COMPANY, LTD.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Methods and Structures for Semiconductor Devices
- Publication number 20150044819
- Publication date Feb 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THINNING WAFER THEREOF
- Publication number 20150024606
- Publication date Jan 22, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING BONDING STRUCTURES
- Publication number 20150021760
- Publication date Jan 22, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Yeong-Jyh LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Process for Applying Molding Compound
- Publication number 20150008581
- Publication date Jan 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL TRANSFER MOLDING AND APPARATUS FOR PERFORMING THE SAME
- Publication number 20140291881
- Publication date Oct 2, 2014
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140154871
- Publication date Jun 5, 2014
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chien-Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Bor-Ping Jang

Person

Patents Grantslast 30 patents

Method and system for thinning wafer thereof

Wafer level transfer molding and apparatus for performing the same

Mechanisms for forming bonding structures

Method of fabricating semiconductor package structure

Semiconductor package structure

Wafer-level underfill and over-molding

Methods for controlling warpage in packaging

Semiconductor device having a boundary structure, a package on pack...

Semiconductor wafer device and manufacturing method thereof

Method and system for thinning wafer thereof

Interconnect structure for semiconductor package and method of fabr...

Wafer level transfer molding and apparatus for performing the same

Methods for controlling warpage in packaging

Mechanisms for forming bonding structures

Semiconductor device having a boundary structure, a package on pack...

Methods for controlling warpage in packaging

Package on-package process for applying molding compound

Semiconductor wafer device and manufacturing method thereof

Wafer-level molding chase design

Wafer-level underfill and over-molding

Semiconductor wafer device and manufacturing method thereof

Wafer level transfer molding and apparatus for performing the same

Mechanisms for forming bonding structures

Innovative multi-purpose dipping plate

Semiconductor device having a boundary structure, a package on pack...

Methods for controlling warpage in packaging

Semiconductor wafer device

Method and system for thinning wafer thereof

Methods for controlling warpage in packaging

Method and system for manufacturing semiconductor device

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR THINNING WAFER THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE

Methods for Controlling Warpage in Packaging

Wafer Level Transfer Molding and Apparatus for Performing the Same

Mechanisms for Forming Bonding Structures

SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...

Methods for Controlling Warpage in Packaging

SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF

Wafer-Level Underfill and Over-Molding

SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF

Wafer Level Transfer Molding and Apparatus for Performing the Same

Mechanisms For Forming Bonding Structures

SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...

Methods for Controlling Warpage in Packaging

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF FABR...

SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF

METHOD AND SYSTEM FOR THINNING WAFER THEREOF

WAFER-LEVEL MOLDING CHASE DESIGN

Methods for Controlling Warpage in Packaging

Wafer-Level Underfill and Over-Molding

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Methods for Controlling Warpage in Packaging

SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...

Packaging Methods and Structures for Semiconductor Devices

METHOD AND SYSTEM FOR THINNING WAFER THEREOF

MECHANISMS FOR FORMING BONDING STRUCTURES

Package-on-Package Process for Applying Molding Compound

WAFER LEVEL TRANSFER MOLDING AND APPARATUS FOR PERFORMING THE SAME

METHOD AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE