Bora Baloglu

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,823,913
- Issue date Nov 21, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,444,013
- Issue date Sep 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,031,259
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 11,018,102
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 10,985,146
- Issue date Apr 20, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded vibration management system having an array of vibration a...
- Patent number 10,861,798
- Issue date Dec 8, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device with adaptive vertical interconnect and fabricati...
- Patent number 10,790,161
- Issue date Sep 29, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,504,827
- Issue date Dec 10, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 10,468,272
- Issue date Nov 5, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 10,438,910
- Issue date Oct 8, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 10,410,999
- Issue date Sep 10, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relieving through-silicon vias
- Patent number 10,134,635
- Issue date Nov 20, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package and method of manufacturing thereof
- Patent number 10,062,611
- Issue date Aug 28, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded vibration management system
- Patent number 10,032,726
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 9,905,440
- Issue date Feb 27, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package and method of manufacturing thereof
- Patent number 9,741,617
- Issue date Aug 22, 2017
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relieving through-silicon vias
- Patent number 9,607,890
- Issue date Mar 28, 2017
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 9,559,075
- Issue date Jan 31, 2017
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with embedded materials in a molded structure to...
- Patent number 9,349,613
- Issue date May 24, 2016
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded electronic package geometry to control warpage and die stress
- Patent number 9,269,872
- Issue date Feb 23, 2016
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control stiffener ring package and fabrication method
- Patent number 8,986,806
- Issue date Mar 24, 2015
- Amkor Technology, Inc.
- Bora Baloglu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die seal design and method and apparatus for integrated circuit pro...
- Patent number 8,940,587
- Issue date Jan 27, 2015
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20240087914
- Publication date Mar 14, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005832
- Publication date Jan 5, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20220051909
- Publication date Feb 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...
- Publication number 20210280542
- Publication date Sep 9, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20210257346
- Publication date Aug 19, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATI...
- Publication number 20210217631
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20200251354
- Publication date Aug 6, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200185317
- Publication date Jun 11, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...
- Publication number 20200020654
- Publication date Jan 16, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20200006300
- Publication date Jan 2, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATI...
- Publication number 20190304807
- Publication date Oct 3, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20190189599
- Publication date Jun 20, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED VIBRATION MANAGEMENT SYSTEM
- Publication number 20180374800
- Publication date Dec 27, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20180190514
- Publication date Jul 5, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Semiconductor Package and Method of Manufacturing Thereof
- Publication number 20180082896
- Publication date Mar 22, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20180061674
- Publication date Mar 1, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170352613
- Publication date Dec 7, 2017
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...
- Publication number 20170194274
- Publication date Jul 6, 2017
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Semiconductor Package and Method of Manufacturing Thereof
- Publication number 20170140988
- Publication date May 18, 2017
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Electronic Package Geometry To Control Warpage And Die Stress
- Publication number 20160172214
- Publication date Jun 16, 2016
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS

Bora Baloglu

Person

Patents Grantslast 30 patents

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor device with integrated heat distribution and manufact...

Method of manufacturing an electronic device and electronic device...

Semiconductor device and manufacturing method thereof

Method of manufacturing an electronic device and electronic device...

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor device with integrated heat distribution and manufact...

Embedded vibration management system having an array of vibration a...

Electronic device with adaptive vertical interconnect and fabricati...

Semiconductor device and manufacturing method thereof

Method of manufacturing an electronic device and electronic device...

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor device with integrated heat distribution and manufact...

Stress relieving through-silicon vias

Encapsulated semiconductor package and method of manufacturing thereof

Embedded vibration management system

Method of manufacturing an electronic device and electronic device...

Encapsulated semiconductor package and method of manufacturing thereof

Stress relieving through-silicon vias

Semiconductor product with interlocking metal-to-metal bonds and me...

Electronic package with embedded materials in a molded structure to...

Molded electronic package geometry to control warpage and die stress

Warpage control stiffener ring package and fabrication method

Die seal design and method and apparatus for integrated circuit pro...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATI...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATI...

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

EMBEDDED VIBRATION MANAGEMENT SYSTEM

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

Encapsulated Semiconductor Package and Method of Manufacturing Thereof

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...

Encapsulated Semiconductor Package and Method of Manufacturing Thereof

Molded Electronic Package Geometry To Control Warpage And Die Stress