Boris Binder

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a sensor device with a buried deep trench...
- Patent number 11,869,919
- Issue date Jan 9, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Magali Glemet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Producing a buried cavity in a semiconductor substrate
- Patent number 11,393,714
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Andre Roeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor structures, systems and methods with improved integration an...
- Patent number 10,060,816
- Issue date Aug 28, 2018
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor structures, systems and methods with improved integration an...
- Patent number 9,752,943
- Issue date Sep 5, 2017
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor structures, systems and methods with improved integration an...
- Patent number 9,546,923
- Issue date Jan 17, 2017
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure with lamella defined by singulation trench
- Patent number 9,527,725
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical system and method for manufacturing a micromechanic...
- Patent number 9,382,111
- Issue date Jul 5, 2016
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a micromechanical system
- Patent number 9,376,314
- Issue date Jun 28, 2016
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer, a method for processing a wafer, and a method for processing...
- Patent number 9,236,241
- Issue date Jan 12, 2016
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating isolating semiconductor structures using a la...
- Patent number 8,994,127
- Issue date Mar 31, 2015
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor manufacturing and semiconductor device with semicondu...
- Patent number 8,921,974
- Issue date Dec 30, 2014
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of providing a semiconductor structure with forming a sacrif...
- Patent number 8,921,954
- Issue date Dec 30, 2014
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure with lamella defined by singulation trench
- Patent number 8,723,276
- Issue date May 13, 2014
- Infineon Technologies AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor
- Patent number 8,627,720
- Issue date Jan 14, 2014
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of providing a semiconductor structure with forming a sacrif...
- Patent number 8,518,732
- Issue date Aug 27, 2013
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor manufacturing and semiconductor device with semicondu...
- Patent number 8,481,400
- Issue date Jul 9, 2013
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor
- Patent number 8,266,962
- Issue date Sep 18, 2012
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a pressure sensor
- Patent number 7,832,279
- Issue date Nov 16, 2010
- Infineon Technologies AG
- Thoralf Kautzsch
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
HETEROEPITAXIAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A H...
- Publication number 20230123410
- Publication date Apr 20, 2023
- INFINEON TECHNOLOGIES AG
- Stefano PARASCANDOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Sensor Device with a Buried Deep Trench...
- Publication number 20210167117
- Publication date Jun 3, 2021
- Magali Glemet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCING A BURIED CAVITY IN A SEMICONDUCTOR SUBSTRATE
- Publication number 20210013087
- Publication date Jan 14, 2021
- INFINEON TECHNOLOGIES AG
- Andre ROETH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR STRUCTURES, SYSTEMS AND METHODS WITH IMPROVED INTEGRATION AN...
- Publication number 20170089790
- Publication date Mar 30, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Application
MICROMECHANICAL SYSTEM AND METHOD FOR MANUFACTURING A MICROMECHANIC...
- Publication number 20150375999
- Publication date Dec 31, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL SYSTEM AND METHOD FOR MANUFACTURING A MICROMECHANIC...
- Publication number 20150375998
- Publication date Dec 31, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER, A METHOD FOR PROCESSING A WAFER, AND A METHOD FOR PROCESSING...
- Publication number 20150318166
- Publication date Nov 5, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf KAUTZSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR STRUCTURES, SYSTEMS AND METHODS WITH IMPROVED INTEGRATION AN...
- Publication number 20150210533
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING ISOLATING SEMICONDUCTOR STRUCTURES
- Publication number 20150203350
- Publication date Jul 23, 2015
- INFINEON TECHNOLOGIES AG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LAMELLA DEFINED BY SINGULATION TRENCH
- Publication number 20140227818
- Publication date Aug 14, 2014
- INFINEON TECHNOLOGIES AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PROVIDING A SEMICONDUCTOR STRUCTURE WITH FORMING A SACRIF...
- Publication number 20130334624
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Manufacturing and Semiconductor Device with semicondu...
- Publication number 20130328143
- Publication date Dec 12, 2013
- Infeon Technologies AG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of fabricating isolated semiconductor structures
- Publication number 20130134530
- Publication date May 30, 2013
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20130001712
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Providing a Semiconductor Structure with Forming A Sacrif...
- Publication number 20120161254
- Publication date Jun 28, 2012
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Manufacturing and Semiconductor Device with semicondu...
- Publication number 20120068277
- Publication date Mar 22, 2012
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Structure with Lamella Defined by Singulation Trench
- Publication number 20110068420
- Publication date Mar 24, 2011
- INFINEON TECHNOLOGIES AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20100186511
- Publication date Jul 29, 2010
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PRESSURE SENSOR
- Publication number 20100058876
- Publication date Mar 11, 2010
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- G01 - MEASURING TESTING

Boris Binder

Person

Patents Grantslast 30 patents

Method for manufacturing a sensor device with a buried deep trench...

Producing a buried cavity in a semiconductor substrate

Sensor structures, systems and methods with improved integration an...

Sensor structures, systems and methods with improved integration an...

Sensor structures, systems and methods with improved integration an...

Semiconductor structure with lamella defined by singulation trench

Micromechanical system and method for manufacturing a micromechanic...

Method for manufacturing a micromechanical system

Wafer, a method for processing a wafer, and a method for processing...

Method of fabricating isolating semiconductor structures using a la...

Semiconductor manufacturing and semiconductor device with semicondu...

Method of providing a semiconductor structure with forming a sacrif...

Semiconductor structure with lamella defined by singulation trench

Acceleration sensor

Method of providing a semiconductor structure with forming a sacrif...

Semiconductor manufacturing and semiconductor device with semicondu...

Acceleration sensor

Semiconductor device including a pressure sensor

Patents Applicationslast 30 patents

HETEROEPITAXIAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A H...

Method for Manufacturing a Sensor Device with a Buried Deep Trench...

PRODUCING A BURIED CAVITY IN A SEMICONDUCTOR SUBSTRATE

SENSOR STRUCTURES, SYSTEMS AND METHODS WITH IMPROVED INTEGRATION AN...

MICROMECHANICAL SYSTEM AND METHOD FOR MANUFACTURING A MICROMECHANIC...

MICROMECHANICAL SYSTEM AND METHOD FOR MANUFACTURING A MICROMECHANIC...

WAFER, A METHOD FOR PROCESSING A WAFER, AND A METHOD FOR PROCESSING...

SENSOR STRUCTURES, SYSTEMS AND METHODS WITH IMPROVED INTEGRATION AN...

METHOD OF FABRICATING ISOLATING SEMICONDUCTOR STRUCTURES

SEMICONDUCTOR STRUCTURE WITH LAMELLA DEFINED BY SINGULATION TRENCH

METHOD OF PROVIDING A SEMICONDUCTOR STRUCTURE WITH FORMING A SACRIF...

Semiconductor Manufacturing and Semiconductor Device with semicondu...

Method of fabricating isolated semiconductor structures

ACCELERATION SENSOR

Method of Providing a Semiconductor Structure with Forming A Sacrif...

Semiconductor Manufacturing and Semiconductor Device with semicondu...

Semiconductor Structure with Lamella Defined by Singulation Trench

ACCELERATION SENSOR

SEMICONDUCTOR DEVICE INCLUDING A PRESSURE SENSOR