Boseong KIM

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip, memory chip, semiconductor package and memory s...
- Patent number 9,286,950
- Issue date Mar 15, 2016
- Samsung Electronics Co., Ltd.
- Boseong Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,759,958
- Issue date Jun 24, 2014
- Samsung Electronics Co., Ltd.
- Dong-Ki Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20240323566
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Hyunseok SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MANUFACTURING METHOD OF IMAGE SENSOR
- Publication number 20230361150
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Hyeyeon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20230005980
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Boseong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PROCESSING MESSAGE
- Publication number 20170111308
- Publication date Apr 20, 2017
- Samsung Electronics Co., Ltd.
- Boseong KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR CHIP, MEMORY CHIP, SEMICONDUCTOR PACKAGE AND MEMORY S...
- Publication number 20120281449
- Publication date Nov 8, 2012
- Samsung Electronics Co., Ltd.
- Boseong KIM
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE, PACKAGE INCLUDING THE SAME AND METHOD OF FABRICA...
- Publication number 20110227215
- Publication date Sep 22, 2011
- Boseong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20100213591
- Publication date Aug 26, 2010
- Samsaung Electronics Co., Ltd.
- Dong-Ki Ho
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Boseong KIM

Person

Patents Grantslast 30 patents

Semiconductor chip, memory chip, semiconductor package and memory s...

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

IMAGE SENSOR

MANUFACTURING METHOD OF IMAGE SENSOR

IMAGE SENSOR

ELECTRONIC DEVICE AND METHOD FOR PROCESSING MESSAGE

SEMICONDUCTOR CHIP, MEMORY CHIP, SEMICONDUCTOR PACKAGE AND MEMORY S...

ELECTRONIC DEVICE, PACKAGE INCLUDING THE SAME AND METHOD OF FABRICA...

Semiconductor package and method of manufacturing the same