Botao Zhang

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Gilbert, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES
- Publication number 20240063142
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...
- Publication number 20240006332
- Publication date Jan 4, 2024
- Intel Corporation
- Dimitrios Antartis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING
- Publication number 20240006358
- Publication date Jan 4, 2024
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS