Botho Hirschfeld

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for handling substrates at below dew point temp...
- Patent number 9,377,423
- Issue date Jun 28, 2016
- Cascade Microtech, Inc.
- Botho Hirschfeld
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for providing wafer access in a wafer processin...
- Patent number 9,373,533
- Issue date Jun 21, 2016
- Cascade Microtech, Inc.
- Frank Fehrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular prober and method for operating same
- Patent number 9,194,885
- Issue date Nov 24, 2015
- Cascade Microtech, Inc.
- Stojan Kanev
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for contacting a row of contact areas with probe...
- Patent number 9,110,131
- Issue date Aug 18, 2015
- Cascade Microtech, Inc.
- Claus Dietrich
- G01 - MEASURING TESTING
Information Patent Grant
Method for measurement of a power device
- Patent number 8,922,229
- Issue date Dec 30, 2014
- Cascade Microtech, Inc.
- Botho Hirschfeld
- G01 - MEASURING TESTING
Information Patent Grant
Probe station for on-wafer-measurement under EMI-shielding
- Patent number 8,344,744
- Issue date Jan 1, 2013
- Cascade Microtech, Inc.
- Axel Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Device for testing thin elements
- Patent number 7,282,930
- Issue date Oct 16, 2007
- SUSS MicroTec Test Systems GmbH
- Uwe Beier
- G01 - MEASURING TESTING
Information Patent Grant
Tester for pressure sensors
- Patent number 6,688,156
- Issue date Feb 10, 2004
- Karl Suss Dresden GmbH
- Claus Dietrich
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR HANDLING SUBSTRATES AT BELOW DEW POINT TEMP...
- Publication number 20140185649
- Publication date Jul 3, 2014
- Cascade Microtech, Inc.
- Botho Hirschfeld
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING WAFER ACCESS IN A WAFER PROCESSIN...
- Publication number 20140186145
- Publication date Jul 3, 2014
- Cascade Microtech, Inc.
- Frank Fehrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR PROBER AND METHOD FOR OPERATING SAME
- Publication number 20140145743
- Publication date May 29, 2014
- CASCADE MICOTECH, INC.
- Stojan Kanev
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND DEVICE FOR CONTACTING A ROW OF CONTACT AREAS WITH PROBE...
- Publication number 20130027070
- Publication date Jan 31, 2013
- CASCADE MICROTECH INC
- Claus Dietrich
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MEASUREMENT OF A POWER DEVICE
- Publication number 20120146676
- Publication date Jun 14, 2012
- Cascade Microtech, Inc.
- Botho Hirschfeld
- G01 - MEASURING TESTING
Information Patent Application
PROBE STATION FOR ON-WAFER-MEASUREMENT UNDER EMI-SHIELDING
- Publication number 20110227602
- Publication date Sep 22, 2011
- CASCADE MICROTECH DRESDEN GMBH
- Axel SCHMIDT
- G01 - MEASURING TESTING
Information Patent Application
Device for testing thin elements
- Publication number 20070139067
- Publication date Jun 21, 2007
- SUSS MicroTec Test Systems GmbH
- Uwe Beier
- G01 - MEASURING TESTING
Information Patent Application
Tester for pressure sensors
- Publication number 20020152794
- Publication date Oct 24, 2002
- Claus Dietrich
- G01 - MEASURING TESTING

Botho Hirschfeld

Person

Patents Grantslast 30 patents

Systems and methods for handling substrates at below dew point temp...

Systems and methods for providing wafer access in a wafer processin...

Modular prober and method for operating same

Method and device for contacting a row of contact areas with probe...

Method for measurement of a power device

Probe station for on-wafer-measurement under EMI-shielding

Device for testing thin elements

Tester for pressure sensors

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR HANDLING SUBSTRATES AT BELOW DEW POINT TEMP...

SYSTEMS AND METHODS FOR PROVIDING WAFER ACCESS IN A WAFER PROCESSIN...

MODULAR PROBER AND METHOD FOR OPERATING SAME

METHOD AND DEVICE FOR CONTACTING A ROW OF CONTACT AREAS WITH PROBE...

METHOD FOR MEASUREMENT OF A POWER DEVICE

PROBE STATION FOR ON-WAFER-MEASUREMENT UNDER EMI-SHIELDING

Device for testing thin elements

Tester for pressure sensors