Boussagol Alice

Person

Bernin, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for making a composite substrate and composite substrate acc...
- Patent number 9,011,598
- Issue date Apr 21, 2015
- Soitec
- Alice Boussagol
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Strain engineered composite semiconductor substrates and methods of...
- Patent number 8,679,942
- Issue date Mar 25, 2014
- Soitec
- Fabrice Letertre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making substrates and substrates formed therefrom
- Patent number 7,939,428
- Issue date May 10, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Alice Boussagol
- C30 - CRYSTAL GROWTH
Information Patent Grant
Methods for making substrates and substrates formed therefrom
- Patent number 7,839,001
- Issue date Nov 23, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Alice Boussagol
- C30 - CRYSTAL GROWTH
Information Patent Grant
Methods for making substrates and substrates formed therefrom
- Patent number 7,615,468
- Issue date Nov 10, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Alice Boussagol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finishing process for the manufacture of a semiconductor structure
- Patent number 7,514,341
- Issue date Apr 7, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin layer transfer method utilizing co-implantation to reduce blis...
- Patent number 7,326,628
- Issue date Feb 5, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite structure with high heat dissipation
- Patent number 7,256,473
- Issue date Aug 14, 2007
- S.O.I. Tec Silicon on Insulator Technologies
- Bruce Faure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite structure with high heat dissipation
- Patent number 7,135,383
- Issue date Nov 14, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Bruce Faure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of producing a heterogeneous semiconductor structure
- Patent number 6,858,517
- Issue date Feb 22, 2005
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Muriel Martinez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR MAKING SUBSTRATES AND SUBSTRATES FORMED THEREFROM
- Publication number 20110039368
- Publication date Feb 17, 2011
- Alice Boussagol
- C30 - CRYSTAL GROWTH
Information Patent Application
STRAIN ENGINEERED COMPOSITE SEMICONDUCTOR SUBSTRATES AND METHODS OF...
- Publication number 20100127353
- Publication date May 27, 2010
- S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES, S.A.
- Fabrice LETERTRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SUBSTRATES AND SUBSTRATES FORMED THEREFROM
- Publication number 20090289332
- Publication date Nov 26, 2009
- S.O.I.Tec Silicon on Insulator Technologies
- Alice Boussagol
- C30 - CRYSTAL GROWTH
Information Patent Application
METHODS FOR MAKING SUBSTRATES AND SUBSTRATES FORMED THEREFROM
- Publication number 20070287273
- Publication date Dec 13, 2007
- Alice Boussagol
- C30 - CRYSTAL GROWTH
Information Patent Application
Process for simplification of a finishing sequence and structure ob...
- Publication number 20070148910
- Publication date Jun 28, 2007
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for making substrates and substrates formed therefrom
- Publication number 20070141803
- Publication date Jun 21, 2007
- Alice Boussagol
- C30 - CRYSTAL GROWTH
Information Patent Application
COMPOSITE STRUCTURE WITH HIGH HEAT DISSIPATION
- Publication number 20070080372
- Publication date Apr 12, 2007
- S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
- Bruce Faure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making a composite substrate and composite substrate acc...
- Publication number 20070022940
- Publication date Feb 1, 2007
- Alice Boussagol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for holding strain in an island etched in a strained thin l...
- Publication number 20060284252
- Publication date Dec 21, 2006
- Alice Boussagol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite structure with high heat dissipation
- Publication number 20060091400
- Publication date May 4, 2006
- Bruce Faure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin layer transfer method utilizing co-implantation to reduce blis...
- Publication number 20060060943
- Publication date Mar 23, 2006
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PRODUCING A HETEROGENEOUS SEMICONDUCTOR STRUCTURE
- Publication number 20040253795
- Publication date Dec 16, 2004
- Muriel Martinez
- H01 - BASIC ELECTRIC ELEMENTS

Boussagol Alice

Person

Patents Grantslast 30 patents

Method for making a composite substrate and composite substrate acc...

Strain engineered composite semiconductor substrates and methods of...

Methods for making substrates and substrates formed therefrom

Methods for making substrates and substrates formed therefrom

Methods for making substrates and substrates formed therefrom

Finishing process for the manufacture of a semiconductor structure

Thin layer transfer method utilizing co-implantation to reduce blis...

Composite structure with high heat dissipation

Composite structure with high heat dissipation

Methods of producing a heterogeneous semiconductor structure

Patents Applicationslast 30 patents

METHODS FOR MAKING SUBSTRATES AND SUBSTRATES FORMED THEREFROM

STRAIN ENGINEERED COMPOSITE SEMICONDUCTOR SUBSTRATES AND METHODS OF...

METHODS FOR MAKING SUBSTRATES AND SUBSTRATES FORMED THEREFROM

METHODS FOR MAKING SUBSTRATES AND SUBSTRATES FORMED THEREFROM

Process for simplification of a finishing sequence and structure ob...

Methods for making substrates and substrates formed therefrom

COMPOSITE STRUCTURE WITH HIGH HEAT DISSIPATION

Method for making a composite substrate and composite substrate acc...

Process for holding strain in an island etched in a strained thin l...

Composite structure with high heat dissipation

Thin layer transfer method utilizing co-implantation to reduce blis...

METHODS OF PRODUCING A HETEROGENEOUS SEMICONDUCTOR STRUCTURE