Bouwe W. Leenstra

Person

Walden, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vacuum transition for solder bump mold filling
- Patent number 9,498,837
- Issue date Nov 22, 2016
- International Business Machines Corporation
- John J. Garant
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fill head interface with combination vacuum pressure chamber
- Patent number 9,278,401
- Issue date Mar 8, 2016
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure-only molten metal valving apparatus and method
- Patent number 7,401,637
- Issue date Jul 22, 2008
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming a multi-level thin-film electronic packaging st...
- Patent number 6,678,949
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Chandrika Prasad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for use in manufacturing semiconductor devices
- Patent number 6,448,169
- Issue date Sep 10, 2002
- International Business Machines Corporation
- William Brearley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level thin-film electronic packaging structure and related me...
- Patent number 6,281,452
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for use in manufacturing semiconductor devices
- Patent number 6,149,048
- Issue date Nov 21, 2000
- International Business Machines Corporation
- William Brearley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for providing solder interconnections to semiconductor an...
- Patent number 6,099,935
- Issue date Aug 8, 2000
- International Business Machines Corporation
- William Brearley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation top surface reference chuck
- Patent number 5,905,566
- Issue date May 18, 1999
- International Business Machines Corporation
- Ralph R. Comulada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Bottom-surface-metallurgy rework process in ceramic modules
- Patent number 5,722,579
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ET...
- Publication number 20160184926
- Publication date Jun 30, 2016
- SUSS MicroTec Photonic Systems Inc.
- Courtney T. Sheets
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER
- Publication number 20140224860
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING
- Publication number 20110049759
- Publication date Mar 3, 2011
- International Business Machines Corporation
- John J. Garant
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD
- Publication number 20090242614
- Publication date Oct 1, 2009
- International Business Machines Corporation
- GLEN N. BIGGS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pressure-only molten metal valving apparatus and method
- Publication number 20080023526
- Publication date Jan 31, 2008
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for forming a multi-level thin-film electronic packaging st...
- Publication number 20010037565
- Publication date Nov 8, 2001
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS

Bouwe W. Leenstra

Person

Patents Grantslast 30 patents

Vacuum transition for solder bump mold filling

Fill head interface with combination vacuum pressure chamber

Pressure-only molten metal valving apparatus and method

Process for forming a multi-level thin-film electronic packaging st...

Apparatus and method for use in manufacturing semiconductor devices

Multi-level thin-film electronic packaging structure and related me...

Apparatus and method for use in manufacturing semiconductor devices

Apparatus for providing solder interconnections to semiconductor an...

Laser ablation top surface reference chuck

Bottom-surface-metallurgy rework process in ceramic modules

Patents Applicationslast 30 patents

LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ET...

FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER

VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING

METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD

Pressure-only molten metal valving apparatus and method

Process for forming a multi-level thin-film electronic packaging st...