Boxi Liu

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Multiple-chip package with multiple thermal interface materials
- Patent number 10,580,717
- Issue date Mar 3, 2020
- Intel Corporation
- Boxi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
- Publication number 20180374776
- Publication date Dec 27, 2018
- Intel Corporation
- Boxi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180342463
- Publication date Nov 29, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE POLYMER THERMAL INTERFACE MATERIAL WITH SINTERED FILLERS F...
- Publication number 20180323130
- Publication date Nov 8, 2018
- Intel Corporation
- Boxi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180190593
- Publication date Jul 5, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY (BGA) APPARATUS AND METHODS
- Publication number 20170066088
- Publication date Mar 9, 2017
- Intel Corporation
- Mohit Sood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR