Boydd Piper

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Eau Claire, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for aligning and laminating substrates to stiffeners in elec...
- Patent number 5,882,459
- Issue date Mar 16, 1999
- W. L. Gore & Associates, Inc.
- William George Petefish
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for coining solder balls on an electrical circuit package
- Patent number 5,853,517
- Issue date Dec 29, 1998
- W. L. Gore & Associates, Inc.
- William George Petefish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnect system for an area array interconnection us...
- Patent number 5,276,955
- Issue date Jan 11, 1994
- SuperComputer Systems Limited Partnership
- David B. Noddin
- H01 - BASIC ELECTRIC ELEMENTS