BRAD BANISTER

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DANA POINT, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of making a multi-layer interconnect
- Patent number 6,607,939
- Issue date Aug 19, 2003
- Honeywell International Inc.
- Richard Pommer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond-ply structure for interconnection of circuit layer pairs with...
- Patent number 6,576,839
- Issue date Jun 10, 2003
- Honeywell International Inc.
- Richard J. Pommer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer interconnect
- Patent number 6,388,325
- Issue date May 14, 2002
- AlliedSignal Inc.
- Richard Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond ply structure and associated process for interconnection of ci...
- Patent number 6,319,811
- Issue date Nov 20, 2001
- Scott Zimmerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer interconnect
- Publication number 20040124534
- Publication date Jul 1, 2004
- Richard Pommer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer interconnect
- Publication number 20020092159
- Publication date Jul 18, 2002
- Richard Pommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER INTERCONNECT
- Publication number 20020003303
- Publication date Jan 10, 2002
- RICHARD POMMER
- H01 - BASIC ELECTRIC ELEMENTS