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Bradley C. John
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Sheridan, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Micro-device packaging
Patent number
7,482,682
Issue date
Jan 27, 2009
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Self-aligned coating on released MEMS
Patent number
7,470,557
Issue date
Dec 30, 2008
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
G11 - INFORMATION STORAGE
Information
Patent Grant
Wafer packaging and singulation method
Patent number
7,196,410
Issue date
Mar 27, 2007
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Wafer packaging and singulation method
Patent number
7,026,189
Issue date
Apr 11, 2006
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
Controlling bond fronts in wafer-scale packaging
Publication number
20070090479
Publication date
Apr 26, 2007
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Micro-device packaging
Publication number
20060226524
Publication date
Oct 12, 2006
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Wafer packaging and singulation method
Publication number
20060128064
Publication date
Jun 15, 2006
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Self-aligned coating on released MEMS
Publication number
20050233596
Publication date
Oct 20, 2005
Hewlett-Packard Development Co., L.P.
Chien-Hua Chen
G01 - MEASURING TESTING
Information
Patent Application
Wafer packaging and singulation method
Publication number
20050176166
Publication date
Aug 11, 2005
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY