Bradley H. Carter

Person

Kokomo, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fuel injector with a trimmable heater and an increased heater conta...
- Patent number 9,291,136
- Issue date Mar 22, 2016
- Delphi Technologies, Inc.
- Jason C. Short
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
Method for improving the thermal cycled adhesion of thick-film cond...
- Patent number 7,294,390
- Issue date Nov 13, 2007
- Delphi Technologies, Inc.
- Bradley H. Carter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-based solder alloys containing copper
- Patent number 6,811,892
- Issue date Nov 2, 2004
- Delphi Technologies, Inc.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy and solder reflow process
- Patent number 6,767,411
- Issue date Jul 27, 2004
- Delphi Technologies, Inc.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leach-resistant solder alloys for silver-based thick-film conductors
- Patent number 6,630,251
- Issue date Oct 7, 2003
- Delphi Technologies, Inc.
- Bradley H. Carter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder process and solder alloy therefor
- Patent number 6,619,536
- Issue date Sep 16, 2003
- Delphi Technologies, Inc.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder process and solder alloy therefor
- Patent number 6,570,260
- Issue date May 27, 2003
- Delphi Technologies, Inc.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thick-film paste with insoluble additive
- Patent number 6,328,914
- Issue date Dec 11, 2001
- Delphi Technologies, Inc.
- Frans Peter Lautzenhiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-current circuit trace and composition and method therefor
- Patent number 6,221,514
- Issue date Apr 24, 2001
- Delphi Technologies, Inc.
- Kevin Joseph Hawes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fatigue-resistant lead-free alloy
- Patent number 5,938,862
- Issue date Aug 17, 1999
- Delco Electronics Corporation
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite solder paste for flip chip bumping
- Patent number 5,803,340
- Issue date Sep 8, 1998
- Delco Electronics Corporation
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
THFA/PDP thermoset thick films for printed circuits
- Patent number 5,464,570
- Issue date Nov 7, 1995
- Delco Electronics Corporation
- Frans P. Lautzenhiser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FUEL INJECTOR WITH A TRIMMABLE HEATER AND AN INCREASED HEATER CONTA...
- Publication number 20140097269
- Publication date Apr 10, 2014
- JASON C. SHORT
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Application
Fuel Injector with a Trimmable Heater and an Increased Heater Conta...
- Publication number 20120048962
- Publication date Mar 1, 2012
- Jason C. Short
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Application
Ultra-thick thick film on ceramic substrate
- Publication number 20090001546
- Publication date Jan 1, 2009
- Lynda G. Flederbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with controlled solder joint thickness
- Publication number 20060255476
- Publication date Nov 16, 2006
- Frederick F. Kuhlman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for improving the thermal cycled adhesion of thick-film cond...
- Publication number 20060240231
- Publication date Oct 26, 2006
- Bradley H. Carter
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Lead-based solder alloys containing copper
- Publication number 20040035909
- Publication date Feb 26, 2004
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder alloy and solder reflow process
- Publication number 20030175146
- Publication date Sep 18, 2003
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PROCESS AND SOLDER ALLOY THEREFOR
- Publication number 20030155402
- Publication date Aug 21, 2003
- DELPHI TECHNOLOGIES, INC.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Bradley H. Carter

Person

Patents Grantslast 30 patents

Fuel injector with a trimmable heater and an increased heater conta...

Method for improving the thermal cycled adhesion of thick-film cond...

Lead-based solder alloys containing copper

Lead-free solder alloy and solder reflow process

Leach-resistant solder alloys for silver-based thick-film conductors

Solder process and solder alloy therefor

Solder process and solder alloy therefor

Thick-film paste with insoluble additive

High-current circuit trace and composition and method therefor

Fatigue-resistant lead-free alloy

Composite solder paste for flip chip bumping

THFA/PDP thermoset thick films for printed circuits

Patents Applicationslast 30 patents

FUEL INJECTOR WITH A TRIMMABLE HEATER AND AN INCREASED HEATER CONTA...

Fuel Injector with a Trimmable Heater and an Increased Heater Conta...

Ultra-thick thick film on ceramic substrate

Electronic assembly with controlled solder joint thickness

Method for improving the thermal cycled adhesion of thick-film cond...

Lead-based solder alloys containing copper

Lead-free solder alloy and solder reflow process

SOLDER PROCESS AND SOLDER ALLOY THEREFOR