Brandon C. Hamilton

Person

Marion, IA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Maskless etching of electronic substrates via precision dispense pr...
- Patent number 11,749,539
- Issue date Sep 5, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and device including memristor material
- Patent number 11,631,808
- Issue date Apr 18, 2023
- Rockwell Collins, Inc.
- Kyle B. Snyder
- G11 - INFORMATION STORAGE
Information Patent Grant
Custom photolithography masking via precision dispense process
- Patent number 11,626,286
- Issue date Apr 11, 2023
- Rockwell Collins, Inc.
- Jenny Calubayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including integrated circuit die mechanically i...
- Patent number 11,605,570
- Issue date Mar 14, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including mold material with recessed conductiv...
- Patent number 11,515,225
- Issue date Nov 29, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device with thermally controlled performance
- Patent number 11,474,576
- Issue date Oct 18, 2022
- Rockwell Collins, Inc.
- Alan P. Boone
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and device including memristor material
- Patent number 11,469,373
- Issue date Oct 11, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and device including memristor material
- Patent number 11,462,267
- Issue date Oct 4, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- G11 - INFORMATION STORAGE
Information Patent Grant
System and device including memristor materials in parallel
- Patent number 11,456,418
- Issue date Sep 27, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- G11 - INFORMATION STORAGE
Information Patent Grant
Conformal multi-plane material deposition
- Patent number 11,276,641
- Issue date Mar 15, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled induced warping of electronic substrates via electroplating
- Patent number 11,236,436
- Issue date Feb 1, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled induced warping of electronic substrates
- Patent number 11,239,182
- Issue date Feb 1, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic manufactured mesoscopic microelectronics interconnect
- Patent number 11,233,030
- Issue date Jan 25, 2022
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-in-die-cavity packaging
- Patent number 10,727,203
- Issue date Jul 28, 2020
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interferometric direction finding antenna
- Patent number 10,454,185
- Issue date Oct 22, 2019
- Rockwell Collins, Inc.
- Jiwon L. Moran
- G01 - MEASURING TESTING
Information Patent Grant
Shielding encapsulation for electrical circuitry
- Patent number 9,545,043
- Issue date Jan 10, 2017
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for optically storing a binary state
- Patent number 9,355,544
- Issue date May 31, 2016
- Rockwell Collins, Inc.
- Reginald D. Bean
- G08 - SIGNALLING
Information Patent Grant
Shielding and potting for electrical circuits
- Patent number 8,822,844
- Issue date Sep 2, 2014
- Rockwell Collins, Inc.
- Mark T. Dimke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass thick film embedded passive material
- Patent number 8,585,937
- Issue date Nov 19, 2013
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB external ground plane via conductive coating
- Patent number 8,461,698
- Issue date Jun 11, 2013
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass thick film embedded passive material
- Patent number 8,119,040
- Issue date Feb 21, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND DEVICE INCLUDING MEMRISTOR MATERIAL
- Publication number 20220181548
- Publication date Jun 9, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND DEVICE INCLUDING MEMRISTOR MATERIAL
- Publication number 20220180924
- Publication date Jun 9, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...
- Publication number 20220077016
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...
- Publication number 20220077015
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Device Including Memristor Material
- Publication number 20220077388
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Device Including Memristor Material
- Publication number 20220077390
- Publication date Mar 10, 2022
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled Induced Warping of Electronic Substrates via Electroplating
- Publication number 20210230765
- Publication date Jul 29, 2021
- Rockwell Collins, Inc.
- Richard Korneisel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Controlled Induced Warping of Electronic Substrates
- Publication number 20210233866
- Publication date Jul 29, 2021
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS THICK FILM EMBEDDED PASSIVE MATERIAL
- Publication number 20120118623
- Publication date May 17, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Glass thick film embedded passive material
- Publication number 20100078605
- Publication date Apr 1, 2010
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Brandon C. Hamilton

Person

Patents Grantslast 30 patents

Maskless etching of electronic substrates via precision dispense pr...

System and device including memristor material

Custom photolithography masking via precision dispense process

Reconstituted wafer including integrated circuit die mechanically i...

Reconstituted wafer including mold material with recessed conductiv...

Electrical device with thermally controlled performance

System and device including memristor material

System and device including memristor material

System and device including memristor materials in parallel

Conformal multi-plane material deposition

Controlled induced warping of electronic substrates via electroplating

Controlled induced warping of electronic substrates

Microfluidic manufactured mesoscopic microelectronics interconnect

Die-in-die-cavity packaging

Interferometric direction finding antenna

Shielding encapsulation for electrical circuitry

Method and apparatus for optically storing a binary state

Shielding and potting for electrical circuits

Glass thick film embedded passive material

PCB external ground plane via conductive coating

Glass thick film embedded passive material

Patents Applicationslast 30 patents

SYSTEM AND DEVICE INCLUDING MEMRISTOR MATERIAL

SYSTEM AND DEVICE INCLUDING MEMRISTOR MATERIAL

RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...

RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...

System and Device Including Memristor Material

System and Device Including Memristor Material

Controlled Induced Warping of Electronic Substrates via Electroplating

Controlled Induced Warping of Electronic Substrates

GLASS THICK FILM EMBEDDED PASSIVE MATERIAL

Glass thick film embedded passive material