Brenda Lee Peterson

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical assemblies for transmitting and manipulating optical beams
- Patent number 8,089,133
- Issue date Jan 3, 2012
- International Business Machines Corporation
- Dinesh Gupta
- G02 - OPTICS
Information Patent Grant
Method of making an electronic package
- Patent number 7,278,207
- Issue date Oct 9, 2007
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic package
- Patent number 6,961,995
- Issue date Nov 8, 2005
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical assemblies for transmitting and manipulating optical beams
- Patent number 6,836,015
- Issue date Dec 28, 2004
- International Business Machines Corporation
- Monty M. Denneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for semiconductor chip carriers
- Patent number 6,740,959
- Issue date May 25, 2004
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for displacing an article during screening
- Patent number 6,595,136
- Issue date Jul 22, 2003
- International Business Machines Corporation
- Ralph R. Comulada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for displacing an article during screening
- Patent number 6,543,347
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Ralph R. Comulada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant layer for encapsulated columns
- Patent number 6,486,415
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for screening features on an electronic substrate with a lo...
- Patent number 6,475,555
- Issue date Nov 5, 2002
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive adhesive interconnection with insulating polymer carrier
- Patent number 6,458,623
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density column grid array connections and method thereof
- Patent number 6,429,388
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Powdered metallic sheet method for deposition of substrate conductors
- Patent number 6,402,866
- Issue date Jun 11, 2002
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-patterned substrate layers for being personalized as needed
- Patent number 6,341,417
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Dinesh Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component retainer
- Patent number 6,017,025
- Issue date Jan 25, 2000
- International Business Machines Corporation
- James Gregory Balz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component retainer
- Patent number 5,996,985
- Issue date Dec 7, 1999
- International Business Machines Corporation
- James Gregory Balz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for via fill
- Patent number 5,927,193
- Issue date Jul 27, 1999
- International Business Machines Corporation
- James G. Balz
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Lamination process for producing non-planar substrates
- Patent number 5,846,361
- Issue date Dec 8, 1998
- International Business Machines Corporation
- Benjamin Vito Fasano
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for marking substrates
- Patent number 5,808,268
- Issue date Sep 15, 1998
- International Business Machines Corporation
- James G. Balz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of selectively depositing a metallic layer on a ceramic subs...
- Patent number 5,787,578
- Issue date Aug 4, 1998
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lamination process for producing non-planar substrates
- Patent number 5,645,673
- Issue date Jul 8, 1997
- International Business Machines Corporation
- Benjamin Vito Fasano
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20080076690
- Publication date Mar 27, 2008
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of making an electronic package
- Publication number 20070278654
- Publication date Dec 6, 2007
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making an electronic package
- Publication number 20050250249
- Publication date Nov 10, 2005
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical assemblies for transmitting and manipulating optical beams
- Publication number 20050078376
- Publication date Apr 14, 2005
- Dinesh Gupta
- G02 - OPTICS
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20050066995
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS
- Publication number 20040217464
- Publication date Nov 4, 2004
- International Business Machines Corporation
- Monty M. Denneau
- G02 - OPTICS
Information Patent Application
Temporary chip attach structure with thin films
- Publication number 20030104687
- Publication date Jun 5, 2003
- International Business Machines Corporation
- Enrique C. Abreu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMI shielding for semiconductor chip carriers
- Publication number 20030025180
- Publication date Feb 6, 2003
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant layer for encapsulated columns
- Publication number 20030020150
- Publication date Jan 30, 2003
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive adhesive interconnection with insulating polymer carrier
- Publication number 20020093104
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant layer for encapsulated cloumns
- Publication number 20020092676
- Publication date Jul 18, 2002
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for displacing an article during screening
- Publication number 20020090289
- Publication date Jul 11, 2002
- Ralph R. Comulada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for displacing an article during screening
- Publication number 20020088355
- Publication date Jul 11, 2002
- Ralph R. Comulada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Pre-patterned substrate layers for being personalized as needed
- Publication number 20020023779
- Publication date Feb 28, 2002
- Dinesh Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR SCREENING FEATURES ON AN ELECTRONIC SUBSTRATE WITH A LO...
- Publication number 20020009539
- Publication date Jan 24, 2002
- JON A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS

Brenda Lee Peterson

Person

Patents Grantslast 30 patents

Optical assemblies for transmitting and manipulating optical beams

Method of making an electronic package

Method of making an electronic package

Optical assemblies for transmitting and manipulating optical beams

EMI shielding for semiconductor chip carriers

Method for displacing an article during screening

Apparatus for displacing an article during screening

Compliant layer for encapsulated columns

Process for screening features on an electronic substrate with a lo...

Conductive adhesive interconnection with insulating polymer carrier

High density column grid array connections and method thereof

Powdered metallic sheet method for deposition of substrate conductors

Pre-patterned substrate layers for being personalized as needed

Component retainer

Component retainer

Process for via fill

Lamination process for producing non-planar substrates

Method for marking substrates

Method of selectively depositing a metallic layer on a ceramic subs...

Lamination process for producing non-planar substrates

Patents Applicationslast 30 patents

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

Method of making an electronic package

Method of making an electronic package

Optical assemblies for transmitting and manipulating optical beams

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS

Temporary chip attach structure with thin films

EMI shielding for semiconductor chip carriers

Compliant layer for encapsulated columns

Conductive adhesive interconnection with insulating polymer carrier

Compliant layer for encapsulated cloumns

Method for displacing an article during screening

Apparatus for displacing an article during screening

Pre-patterned substrate layers for being personalized as needed

PROCESS FOR SCREENING FEATURES ON AN ELECTRONIC SUBSTRATE WITH A LO...