Brent M. Roberts

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic device and method of manufacturing same
- Patent number 9,999,129
- Issue date Jun 12, 2018
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer assembly and structures formed thereby
- Patent number 8,659,171
- Issue date Feb 25, 2014
- Intel Corporation
- Brent M. Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package and method for a compression-based mid-leve...
- Patent number 8,440,506
- Issue date May 14, 2013
- Intel Corporation
- Brent M. Roberts
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Patch on interposer assembly and structures formed thereby
- Patent number 8,389,337
- Issue date Mar 5, 2013
- Intel Corporation
- Brent M. Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patch on interposer through PGA interconnect structures
- Patent number 8,381,393
- Issue date Feb 26, 2013
- Intel Corporation
- Brent M. Roberts
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic package and method for a compression-based mid-leve...
- Patent number 8,278,752
- Issue date Oct 2, 2012
- Intel Corporation
- Brent M. Roberts
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Direct power delivery into an electronic package
- Patent number 7,629,680
- Issue date Dec 8, 2009
- Intel Corporation
- Brent M. Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PATCH ON INTERPOSER ASSEMBLY AND STRUCTURES FORMED THEREBY
- Publication number 20130141859
- Publication date Jun 6, 2013
- Brent M. Roberts
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD FOR A COMPRESSION-BASED MID-LEVE...
- Publication number 20120279059
- Publication date Nov 8, 2012
- Brent M. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patch on interposer through PGA interconnect structures
- Publication number 20110157808
- Publication date Jun 30, 2011
- Intel Corporation
- Brent M. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patch on interposer assembly and structures formed thereby
- Publication number 20110156276
- Publication date Jun 30, 2011
- Brent M. Roberts
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD FOR A COMPRESSION-BASED MID-LEVE...
- Publication number 20110147913
- Publication date Jun 23, 2011
- Brent M. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic device and method of manufacturing same
- Publication number 20110108947
- Publication date May 12, 2011
- John S. Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct power delivery into an electronic package
- Publication number 20070222059
- Publication date Sep 27, 2007
- Brent M. Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Brent M. Roberts

Person

Patents Grantslast 30 patents

Microelectronic device and method of manufacturing same

Patch on interposer assembly and structures formed thereby

Microelectronic package and method for a compression-based mid-leve...

Patch on interposer assembly and structures formed thereby

Patch on interposer through PGA interconnect structures

Microelectronic package and method for a compression-based mid-leve...

Direct power delivery into an electronic package

Patents Applicationslast 30 patents

PATCH ON INTERPOSER ASSEMBLY AND STRUCTURES FORMED THEREBY

MICROELECTRONIC PACKAGE AND METHOD FOR A COMPRESSION-BASED MID-LEVE...

Patch on interposer through PGA interconnect structures

Patch on interposer assembly and structures formed thereby

MICROELECTRONIC PACKAGE AND METHOD FOR A COMPRESSION-BASED MID-LEVE...

Microelectronic device and method of manufacturing same

Direct power delivery into an electronic package