Brent Teasley

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Silex, MO, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of estimating post-polishing waviness characteristics of a s...
- Patent number 6,613,591
- Issue date Sep 2, 2003
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Method for wafer processing
- Patent number 6,514,423
- Issue date Feb 4, 2003
- MEMC Electronic Materials, Inc.
- Kan-Yin Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to place wafers into and out of machine
- Patent number 6,398,631
- Issue date Jun 4, 2002
- MEMC Electronic Materials, Inc.
- Gary L. Anderson
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ESTIMATING POST-POLISHING WAVINESS CHARACTERISTICS OF A S...
- Publication number 20030170920
- Publication date Sep 11, 2003
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING