Brett C. Baker-O'Neal

Person

Sleepy Hollow, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a photovoltaic device by uniform plating on...
- Patent number 10,199,516
- Issue date Feb 5, 2019
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Interconnects based on subtractive etching of silver
- Patent number 9,911,648
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a photovoltaic device by uniform plating on...
- Patent number 9,716,192
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects based on subtractive etching of silver
- Patent number 9,564,362
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic cells with copper grid
- Patent number 8,901,414
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Microstructure modification in copper interconnect structure
- Patent number 8,008,199
- Issue date Aug 30, 2011
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstructure modification in copper interconnect structure
- Patent number 7,843,063
- Issue date Nov 30, 2010
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,736,474
- Issue date Jun 15, 2010
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 7,479,213
- Issue date Jan 20, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...
- Publication number 20170309760
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS BASED ON SUBTRACTIVE ETCHING OF SILVER
- Publication number 20170062274
- Publication date Mar 2, 2017
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS BASED ON SUBTRACTIVE ETCHING OF SILVER
- Publication number 20160233127
- Publication date Aug 11, 2016
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE AND STRUCTURE FOR PHOTOVOLTAICS INCLUDING METAL-RICH SI...
- Publication number 20150325716
- Publication date Nov 12, 2015
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...
- Publication number 20150280022
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Brett Caroline Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOVOLTAIC CELLS WITH COPPER GRID
- Publication number 20130061916
- Publication date Mar 14, 2013
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PHOTOVOLTAIC CELLS WITH COPPER GRID
- Publication number 20130065351
- Publication date Mar 14, 2013
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE
- Publication number 20100323517
- Publication date Dec 23, 2010
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20100219078
- Publication date Sep 2, 2010
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE
- Publication number 20090206484
- Publication date Aug 20, 2009
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT ELECTRODEPOSITION OF COPPER ONTO TA-ALLOY BARRIERS
- Publication number 20090130845
- Publication date May 21, 2009
- International Business Machines Corporation
- Brett Baker-O'Neal
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method
- Publication number 20090095634
- Publication date Apr 16, 2009
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic processing apparatus and method
- Publication number 20070034526
- Publication date Feb 15, 2007
- Natsuki Makino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20060086616
- Publication date Apr 27, 2006
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Brett C. Baker-O'Neal

Person

Patents Grantslast 30 patents

Method for fabricating a photovoltaic device by uniform plating on...

Interconnects based on subtractive etching of silver

Method for fabricating a photovoltaic device by uniform plating on...

Interconnects based on subtractive etching of silver

Photovoltaic cells with copper grid

Microstructure modification in copper interconnect structure

Microstructure modification in copper interconnect structure

Plating apparatus and plating method

Plating method and plating apparatus

Patents Applicationslast 30 patents

SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...

INTERCONNECTS BASED ON SUBTRACTIVE ETCHING OF SILVER

INTERCONNECTS BASED ON SUBTRACTIVE ETCHING OF SILVER

MANUFACTURE AND STRUCTURE FOR PHOTOVOLTAICS INCLUDING METAL-RICH SI...

SURFACE PREPARATION AND UNIFORM PLATING ON THROUGH WAFER VIAS AND I...

PHOTOVOLTAIC CELLS WITH COPPER GRID

PHOTOVOLTAIC CELLS WITH COPPER GRID

MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE

PLATING APPARATUS AND PLATING METHOD

MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE

DIRECT ELECTRODEPOSITION OF COPPER ONTO TA-ALLOY BARRIERS

Plating method

Electrolytic processing apparatus and method

Plating apparatus and plating method