Brett E. Huff

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Design structures of and simplified methods for forming field emiss...
- Patent number 6,771,011
- Issue date Aug 3, 2004
- Intel Corporation
- Michael A. Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Approach to optimizing an ILD argon sputter process
- Patent number 6,645,353
- Issue date Nov 11, 2003
- Intel Corporation
- Brett E. Huff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming microtips in a field emission device
- Patent number 6,572,425
- Issue date Jun 3, 2003
- Intel Corporation
- Michael A. Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing by polishing a structure which is formed to p...
- Patent number 6,096,230
- Issue date Aug 1, 2000
- Intel Corporation
- Kenneth D. Schatz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ pre-ILD deposition treatment to improve ILD to metal adhesion
- Patent number 5,950,107
- Issue date Sep 7, 1999
- Intel Corporation
- Brett E. Huff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DSAD process for deposition of inter layer dielectric
- Patent number 5,872,064
- Issue date Feb 16, 1999
- Intel Corporation
- Brett E. Huff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of an inter layer dielectric formed on semiconductor waf...
- Patent number 5,872,401
- Issue date Feb 16, 1999
- Intel Corporation
- Brett E. Huff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density TEOS-based film for intermetal dielectrics
- Patent number 5,389,581
- Issue date Feb 14, 1995
- Intel Corporation
- Philip Freiberger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Design structures of and simplified methods for forming field emiss...
- Publication number 20030146682
- Publication date Aug 7, 2003
- Michael A. Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL APPROACH TO OPTIMIZING AN ILD ARGON SPUTTER PROCESS
- Publication number 20030136664
- Publication date Jul 24, 2003
- BRETT E. HUFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design structures of and simplified methods for forming field emiss...
- Publication number 20020140335
- Publication date Oct 3, 2002
- Michael A. Maxim
- H01 - BASIC ELECTRIC ELEMENTS

Brett E. Huff

Person

Patents Grantslast 30 patents

Design structures of and simplified methods for forming field emiss...

Approach to optimizing an ILD argon sputter process

Methods for forming microtips in a field emission device

Method of planarizing by polishing a structure which is formed to p...

In-situ pre-ILD deposition treatment to improve ILD to metal adhesion

DSAD process for deposition of inter layer dielectric

Deposition of an inter layer dielectric formed on semiconductor waf...

High density TEOS-based film for intermetal dielectrics

Patents Applicationslast 30 patents

Design structures of and simplified methods for forming field emiss...

NOVEL APPROACH TO OPTIMIZING AN ILD ARGON SPUTTER PROCESS

Design structures of and simplified methods for forming field emiss...