Brett H. Engel

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Diffusion barrier layer formation
- Patent number 10,319,633
- Issue date Jun 11, 2019
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer formation
- Patent number 10,170,359
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer formation
- Patent number 9,847,251
- Issue date Dec 19, 2017
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer formation
- Patent number 9,406,554
- Issue date Aug 2, 2016
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic capacitance tuning for robust middle of the line contact...
- Patent number 9,224,675
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Patrick W. DeHaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision polysilicon resistors
- Patent number 9,000,564
- Issue date Apr 7, 2015
- STMicroelectronics, Inc.
- Pietro Montanini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlapping contacts for semiconductor device
- Patent number 8,940,634
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit contact structure and method
- Patent number 8,580,628
- Issue date Nov 12, 2013
- GLOBALFOUNDRIES, INC.
- André P. Labonté
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Converting metal mask to metal-oxide etch stop layer and related se...
- Patent number 8,435,891
- Issue date May 7, 2013
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier dielectric stack for seam protection
- Patent number 7,397,073
- Issue date Jul 8, 2008
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge seal for a semiconductor device
- Patent number 7,163,883
- Issue date Jan 16, 2007
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-functional structure for enhanced chip manufacturibility and...
- Patent number 7,098,676
- Issue date Aug 29, 2006
- International Business Machines Corporation
- William F. Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reworking structures incorporating low-k dielectric mater...
- Patent number 7,008,803
- Issue date Mar 7, 2006
- International Business Machines Corporation
- Terence Lawrence Kane
- G01 - MEASURING TESTING
Information Patent Grant
Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures...
- Patent number 6,914,320
- Issue date Jul 5, 2005
- International Business Machines Corporation
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures...
- Patent number 6,887,783
- Issue date May 3, 2005
- International Business Machines Corporation
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for reducing thermo-mechanical stress in stack...
- Patent number 6,831,363
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Timothy J. Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an edge seal for a semiconductor device
- Patent number 6,734,090
- Issue date May 11, 2004
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chromium adhesion layer for copper vias in low-k technology
- Patent number 6,539,625
- Issue date Apr 1, 2003
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure and method for reduced downward force wirebonding
- Patent number 6,478,212
- Issue date Nov 12, 2002
- International Business Machines Corporation
- Brett H. Engel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-supporting air bridge interconnect structure for integrated ci...
- Patent number 6,472,740
- Issue date Oct 29, 2002
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20180374746
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20180047622
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NiPt AND Ti INTERSECTING SILICIDE PROCESS AND STRUCTURE
- Publication number 20170271471
- Publication date Sep 21, 2017
- International Business Machines Corporation
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NiPt AND Ti INTERSECTING SILICIDE PROCESS AND STRUCTURE
- Publication number 20170194454
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Nicolas L. Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20160276217
- Publication date Sep 22, 2016
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20160268161
- Publication date Sep 15, 2016
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FORMATION
- Publication number 20160093526
- Publication date Mar 31, 2016
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING INTEGRATED CIRCUITS HAVING A COMPRESSIVE N...
- Publication number 20140183720
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Scott Beasor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION POLYSILICON RESISTORS
- Publication number 20140175609
- Publication date Jun 26, 2014
- Pietro Montanini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAPPING CONTACTS FOR SEMICONDUCTOR DEVICE
- Publication number 20130241070
- Publication date Sep 19, 2013
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONTACT STRUCTURE AND METHOD
- Publication number 20130200441
- Publication date Aug 8, 2013
- GLOBALFOUNDRIES INC.
- André P. Labonté
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAPPING CONTACTS FOR SEMICONDUCTOR DEVICE
- Publication number 20130001786
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVERTING METAL MASK TO METAL-OXIDE ETCH STOP LAYER AND RELATED SE...
- Publication number 20120306093
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER DIELECTRIC STACK FOR SEAM PROTECTION
- Publication number 20080227247
- Publication date Sep 18, 2008
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DIELECTRIC STRUCTURE FORMATION USING RADIATION
- Publication number 20070099433
- Publication date May 3, 2007
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Dielectric Stack for Seam Protection
- Publication number 20060108609
- Publication date May 25, 2006
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20060014376
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reworking structures incorporating low-k dielectric mater...
- Publication number 20050285106
- Publication date Dec 29, 2005
- International Business Machines Corporation
- Terence Lawrence Kane
- G01 - MEASURING TESTING
Information Patent Application
Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structur...
- Publication number 20040173907
- Publication date Sep 9, 2004
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-functional structure for enhanced chip manufacturibility & re...
- Publication number 20040129938
- Publication date Jul 8, 2004
- International Business Machines Corporation
- William F. Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for reducing thermo-mechanical stress in stack...
- Publication number 20040113278
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Timothy J. Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures...
- Publication number 20040115873
- Publication date Jun 17, 2004
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20040101663
- Publication date May 27, 2004
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge seal for a semiconductor device
- Publication number 20040087078
- Publication date May 6, 2004
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reworking structures incorporating low-k dielectric mater...
- Publication number 20040082176
- Publication date Apr 29, 2004
- Intenational Business Machines Corporation
- Terence Lawrence Kane
- G01 - MEASURING TESTING
Information Patent Application
Edge seal for a semiconductor device
- Publication number 20030157794
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structur...
- Publication number 20030134499
- Publication date Jul 17, 2003
- International Business Machines Corporation
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High modulus film structure for enhanced electromigration resistance
- Publication number 20020132471
- Publication date Sep 19, 2002
- International Business Machines Corporation
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chromium adhesion layer for copper vias in low-k technology
- Publication number 20020088117
- Publication date Jul 11, 2002
- Brett H. Engel
- H01 - BASIC ELECTRIC ELEMENTS

Brett H. Engel

Person

Patents Grantslast 30 patents

Diffusion barrier layer formation

Diffusion barrier layer formation

Diffusion barrier layer formation

Diffusion barrier layer formation

Automatic capacitance tuning for robust middle of the line contact...

Precision polysilicon resistors

Overlapping contacts for semiconductor device

Integrated circuit contact structure and method

Converting metal mask to metal-oxide etch stop layer and related se...

Barrier dielectric stack for seam protection

Edge seal for a semiconductor device

Multi-functional structure for enhanced chip manufacturibility and...

Method of reworking structures incorporating low-k dielectric mater...

Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures...

Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures...

Structure and method for reducing thermo-mechanical stress in stack...

Method of making an edge seal for a semiconductor device

Chromium adhesion layer for copper vias in low-k technology

Bond pad structure and method for reduced downward force wirebonding

Self-supporting air bridge interconnect structure for integrated ci...

Patents Applicationslast 30 patents

DIFFUSION BARRIER LAYER FORMATION

DIFFUSION BARRIER LAYER FORMATION

NiPt AND Ti INTERSECTING SILICIDE PROCESS AND STRUCTURE

NiPt AND Ti INTERSECTING SILICIDE PROCESS AND STRUCTURE

DIFFUSION BARRIER LAYER FORMATION

DIFFUSION BARRIER LAYER FORMATION

DIFFUSION BARRIER LAYER FORMATION

METHODS OF MANUFACTURING INTEGRATED CIRCUITS HAVING A COMPRESSIVE N...

PRECISION POLYSILICON RESISTORS

OVERLAPPING CONTACTS FOR SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT CONTACT STRUCTURE AND METHOD

OVERLAPPING CONTACTS FOR SEMICONDUCTOR DEVICE

CONVERTING METAL MASK TO METAL-OXIDE ETCH STOP LAYER AND RELATED SE...

BARRIER DIELECTRIC STACK FOR SEAM PROTECTION

GAS DIELECTRIC STRUCTURE FORMATION USING RADIATION

Barrier Dielectric Stack for Seam Protection

Stacked via-stud with improved reliability in copper metallurgy

Method of reworking structures incorporating low-k dielectric mater...

Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structur...

Multi-functional structure for enhanced chip manufacturibility & re...

Structure and method for reducing thermo-mechanical stress in stack...

Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures...

Stacked via-stud with improved reliability in copper metallurgy

Edge seal for a semiconductor device

Method of reworking structures incorporating low-k dielectric mater...

Edge seal for a semiconductor device

Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structur...

High modulus film structure for enhanced electromigration resistance

Chromium adhesion layer for copper vias in low-k technology