Brett P. Wilkerson

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fanout module integrating a photonic integrated circuit
- Patent number 12,276,850
- Issue date Apr 15, 2025
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- G02 - OPTICS
Information Patent Grant
Semiconductor package with annular package lid structure
- Patent number 12,278,150
- Issue date Apr 15, 2025
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 12,266,585
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed density interconnect architectures using hybrid fan-out
- Patent number 12,266,611
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package with anchor structures
- Patent number 12,249,519
- Issue date Mar 11, 2025
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package with die-mounted voltage regulator
- Patent number 12,165,981
- Issue date Dec 10, 2024
- Advanced Micro Devices, Inc.
- Gabriel H Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded interconnect bridging
- Patent number 12,107,075
- Issue date Oct 1, 2024
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,855,061
- Issue date Dec 26, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for enabling die reuse in 3D stacked products
- Patent number 11,804,479
- Issue date Oct 31, 2023
- Advanced Micro Devices, Inc.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with reinforcing rivets
- Patent number 11,742,301
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fanout module integrating a photonic integrated circuit
- Patent number 11,709,327
- Issue date Jul 25, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- G02 - OPTICS
Information Patent Grant
Hybrid bonded interconnect bridging
- Patent number 11,676,940
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,437,359
- Issue date Sep 6, 2022
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package with anchor structures
- Patent number 11,367,628
- Issue date Jun 21, 2022
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,189,540
- Issue date Nov 30, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,164,807
- Issue date Nov 2, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 10,573,630
- Issue date Feb 25, 2020
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 10,431,517
- Issue date Oct 1, 2019
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and dummy components for improved thermal performance
- Patent number 10,312,221
- Issue date Jun 4, 2019
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with compliant interconnects
- Patent number 9,324,667
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having large solder pads and method for...
- Patent number 8,766,453
- Issue date Jul 1, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an air gap and method for fo...
- Patent number 8,704,370
- Issue date Apr 22, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die level metal density gradient for improved flip chip package rel...
- Patent number 7,276,435
- Issue date Oct 2, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having structural support for a flip-chip interc...
- Patent number 7,247,552
- Issue date Jul 24, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STIFFENER WITH INTEGRATED CONNECTORS
- Publication number 20250079276
- Publication date Mar 6, 2025
- ADVANCED MICRO DEVICES, INC.
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
- Publication number 20250070031
- Publication date Feb 27, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
- Publication number 20250022847
- Publication date Jan 16, 2025
- ADVANCED MICRO DEVICES, INC.
- LEI FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH A GLASS INTERPOSER
- Publication number 20240371714
- Publication date Nov 7, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS
- Publication number 20240063206
- Publication date Feb 22, 2024
- ADVANCED MICRO DEVICES, INC.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY
- Publication number 20240047228
- Publication date Feb 8, 2024
- ADVANCED MICRO DEVICES, INC.
- Sri Ranga Sai Boyapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20240019649
- Publication date Jan 18, 2024
- ADVANCED MICRO DEVICES, INC.
- BRETT P. WILKERSON
- G02 - OPTICS
Information Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
- Publication number 20230387076
- Publication date Nov 30, 2023
- ADVANCED MICRO DEVICES, INC.
- LEI FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...
- Publication number 20230307405
- Publication date Sep 28, 2023
- ADVANCED MICRO DEVICES, INC.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN EMBEDDED ACTIVE DEVICE
- Publication number 20230207544
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- Gabriel H. Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING
- Publication number 20230201952
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
- Publication number 20230197619
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- Gabriel H LOH
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR CHIP DEVICE
- Publication number 20230187364
- Publication date Jun 15, 2023
- ADVANCED MICRO DEVICES, INC.
- Chia-Hao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ANNULAR PACKAGE LID STRUCTURE
- Publication number 20230093924
- Publication date Mar 30, 2023
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20220392882
- Publication date Dec 8, 2022
- ADVANCED MICRO DEVICES, INC.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20220342165
- Publication date Oct 27, 2022
- ADVANCED MICRO DEVICES, INC.
- BRETT P. WILKERSON
- G02 - OPTICS
Information Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
- Publication number 20220319871
- Publication date Oct 6, 2022
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DIE-LAST WAFER-LEVEL FANOUT PACKAGE WITH FIBER ATTACH CAPAB...
- Publication number 20220206221
- Publication date Jun 30, 2022
- ADVANCED MICRO DEVICES, INC.
- SIDDHARTH RAVICHANDRAN
- G02 - OPTICS
Information Patent Application
STRUCTURAL THERMAL INTERFACING FOR LIDDED SEMICONDUCTOR PACKAGES
- Publication number 20220199429
- Publication date Jun 23, 2022
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20220059425
- Publication date Feb 24, 2022
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED DENSITY INTERCONNECT ARCHITECTURES USING HYBRID FAN-OUT
- Publication number 20220051989
- Publication date Feb 17, 2022
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
- Publication number 20220052023
- Publication date Feb 17, 2022
- ADVANCED MICRO DEVICES, INC.
- LEI FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS
- Publication number 20210098441
- Publication date Apr 1, 2021
- ADVANCED MICRO DEVICES, INC.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE WITH REINFORCING RIVETS
- Publication number 20210057352
- Publication date Feb 25, 2021
- ADVANCED MICRO DEVICES, INC.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
- Publication number 20210020459
- Publication date Jan 21, 2021
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20200194413
- Publication date Jun 18, 2020
- ADVANCED MICRO DEVICES, INC.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20190393123
- Publication date Dec 26, 2019
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20190393124
- Publication date Dec 26, 2019
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20190326272
- Publication date Oct 24, 2019
- ADVANCED MICRO DEVICES, INC.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND DUMMY COMPONENTS FOR IMPROVED THERMAL PERFORMANCE
- Publication number 20190189590
- Publication date Jun 20, 2019
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS

Brett P. Wilkerson

Person

Patents Grantslast 30 patents

Fanout module integrating a photonic integrated circuit

Semiconductor package with annular package lid structure

Arrangement and thermal management of 3D stacked dies

Mixed density interconnect architectures using hybrid fan-out

Molded chip package with anchor structures

3D semiconductor package with die-mounted voltage regulator

Hybrid bonded interconnect bridging

Low temperature hybrid bonding

Offset-aligned three-dimensional integrated circuit

Scheme for enabling die reuse in 3D stacked products

Fan-out package with reinforcing rivets

Fanout module integrating a photonic integrated circuit

Hybrid bonded interconnect bridging

Offset-aligned three-dimensional integrated circuit

Molded chip package with anchor structures

Arrangement and thermal management of 3D stacked dies

Arrangement and thermal management of 3D stacked dies

Offset-aligned three-dimensional integrated circuit

Arrangement and thermal management of 3D stacked dies

Stacked dies and dummy components for improved thermal performance

Semiconductor devices with compliant interconnects

Packaged integrated circuit having large solder pads and method for...

Semiconductor package structure having an air gap and method for fo...

Die level metal density gradient for improved flip chip package rel...

Integrated circuit having structural support for a flip-chip interc...

Patents Applicationslast 30 patents

STIFFENER WITH INTEGRATED CONNECTORS

3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR

HYBRID BONDED INTERCONNECT BRIDGING

CHIP PACKAGE WITH A GLASS INTERPOSER

SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS

METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY

FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT

HYBRID BONDED INTERCONNECT BRIDGING

ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...

SEMICONDUCTOR DEVICE WITH AN EMBEDDED ACTIVE DEVICE

LOW TEMPERATURE HYBRID BONDING

3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR

SEMICONDUCTOR CHIP DEVICE

SEMICONDUCTOR PACKAGE WITH ANNULAR PACKAGE LID STRUCTURE

OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT

FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT

MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES

OPTICAL DIE-LAST WAFER-LEVEL FANOUT PACKAGE WITH FIBER ATTACH CAPAB...

STRUCTURAL THERMAL INTERFACING FOR LIDDED SEMICONDUCTOR PACKAGES

ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES

MIXED DENSITY INTERCONNECT ARCHITECTURES USING HYBRID FAN-OUT

HYBRID BONDED INTERCONNECT BRIDGING

SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS

FAN-OUT PACKAGE WITH REINFORCING RIVETS

MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES

OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT

ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES

ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES

OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT

STACKED DIES AND DUMMY COMPONENTS FOR IMPROVED THERMAL PERFORMANCE