Brian A. Webb

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for forming same
- Patent number 6,376,266
- Issue date Apr 23, 2002
- Semiconductor Components Industries LLC
- James Price Letterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transmitter package assembly and methods of manufacture
- Patent number 6,171,877
- Issue date Jan 9, 2001
- Motorola, Inc.
- Brian A. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method of manufacture
- Patent number 6,088,215
- Issue date Jul 11, 2000
- Motorola, Inc.
- Brian A. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of encapsulating electroluminescent apparatus
- Patent number 6,080,031
- Issue date Jun 27, 2000
- Motorola, Inc.
- Stephen P. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device packages containing an optical transmitter die
- Patent number 6,051,848
- Issue date Apr 18, 2000
- Motorola, Inc.
- Brian A. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure, electronic assembly
- Patent number 6,046,901
- Issue date Apr 4, 2000
- Motorola, Inc.
- Benjamin R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid device with optically transmissive coating
- Patent number 5,973,337
- Issue date Oct 26, 1999
- Motorola, Inc.
- James H. Knapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 5,963,782
- Issue date Oct 5, 1999
- Motorola, Inc.
- Brian A. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic electroluminescent device hermetic encapsulation package
- Patent number 5,821,692
- Issue date Oct 13, 1998
- Motorola, Inc.
- Stephen P. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transmitter package assembly including lead frame having ex...
- Patent number 5,808,325
- Issue date Sep 15, 1998
- Motorola, Inc.
- Brian A. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packaging containing a liquid and method
- Patent number 5,477,084
- Issue date Dec 19, 1995
- Motorola, Inc.
- Brian A. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making microelectronic device package containing a liquid
- Patent number 5,413,965
- Issue date May 9, 1995
- Motorola, Inc.
- Brian A. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level semiconductor package
- Patent number 4,994,897
- Issue date Feb 19, 1991
- Motorola, Inc.
- Theodore R. Golubic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe silver bleed elimination
- Patent number 4,903,401
- Issue date Feb 27, 1990
- Motorola, Inc.
- Brian A. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brazed leaded package
- Patent number 4,818,821
- Issue date Apr 4, 1989
- Motorola Inc.
- Robert M. Wentworth
- H01 - BASIC ELECTRIC ELEMENTS

Brian A. Webb

Person

Patents Grantslast 30 patents

Semiconductor package and method for forming same

Optical transmitter package assembly and methods of manufacture

Capacitor and method of manufacture

Methods of encapsulating electroluminescent apparatus

Optical device packages containing an optical transmitter die

Support structure, electronic assembly

Ball grid device with optically transmissive coating

Semiconductor component and method of manufacture

Organic electroluminescent device hermetic encapsulation package

Optical transmitter package assembly including lead frame having ex...

Microelectronic device packaging containing a liquid and method

Method of making microelectronic device package containing a liquid

Multi-level semiconductor package

Leadframe silver bleed elimination

Brazed leaded package