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Brian Condie
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Gilroy, CA, US
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last 30 patents
Information
Patent Grant
Devices incorporating stacked bonds and methods of forming the same
Patent number
11,908,823
Issue date
Feb 20, 2024
Wolfspeed, Inc.
Erwin Orejola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High reliability semiconductor devices and methods of fabricating t...
Patent number
11,488,923
Issue date
Nov 1, 2022
Wolfspeed, Inc.
Sung Chul Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid semiconductor package
Patent number
9,373,577
Issue date
Jun 21, 2016
Infineon Technologies AG
Alexander Komposch
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Semiconductor package having a baseplate with a die attach region a...
Patent number
9,293,407
Issue date
Mar 22, 2016
Infineon Technologies AG
Alexander Komposch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
PCB based RF-power package window frame
Patent number
8,907,467
Issue date
Dec 9, 2014
Infineon Technologies AG
Alexander Komposch
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
Publication number
20230019230
Publication date
Jan 19, 2023
Wolfspeed, Inc.
Sung Chul Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES INCORPORATING STACKED BONDS AND METHODS OF FORMING THE SAME
Publication number
20220223559
Publication date
Jul 14, 2022
Wolfspeed, Inc.
Erwin Orejola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
Publication number
20200373270
Publication date
Nov 26, 2020
Cree, Inc.
Sung Chul Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PCB Based RF-Power Package Window Frame
Publication number
20150048492
Publication date
Feb 19, 2015
INFINEON TECHNOLOGIES AG
Alexander Komposch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Hybrid Semiconductor Package
Publication number
20140346637
Publication date
Nov 27, 2014
Alexander Komposch
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
PCB Based RF-Power Package Window Frame
Publication number
20130256858
Publication date
Oct 3, 2013
INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Alexander Komposch
H01 - BASIC ELECTRIC ELEMENTS