Brian Eugene Parks

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Sherman, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacture integrated circuit package
- Patent number 8,697,496
- Issue date Apr 15, 2014
- Texas Instruments Incorporated
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH WIRE BONDING
- Publication number 20140312474
- Publication date Oct 23, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Alok Prakash Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140175626
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE INTEGRATED CIRCUIT PACKAGE
- Publication number 20140097527
- Publication date Apr 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS