Brian J. Wood

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Hillsboro, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
High density connector design using anisotropically pressure-sensit...
- Patent number 4,808,112
- Issue date Feb 28, 1989
- Tektronix, Inc.
- Brian J. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detachable cable strain relief clamp
- Patent number 4,718,861
- Issue date Jan 12, 1988
- Tektronix, Inc.
- Brian J. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modularized electronic instrument packaging system
- Patent number 4,700,275
- Issue date Oct 13, 1987
- Tektronix, Inc.
- Brian J. Wood
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR