Brian K Burnor

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Fairfax, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Mask and substrate alignment for solder bump process
- Patent number 7,670,437
- Issue date Mar 2, 2010
- International Business Machines Corporation
- Duane E Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask and substrate alignment for solder bump process
- Patent number 7,410,919
- Issue date Aug 12, 2008
- International Business Machines Corporation
- Duane E Allen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MASK AND SUBSTRATE ALIGNMENT FOR SOLDER BUMP PROCESS
- Publication number 20080202421
- Publication date Aug 28, 2008
- Duane E. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK AND SUBSTRATE ALIGNMENT FOR SOLDER BUMP PROCESS
- Publication number 20040261977
- Publication date Dec 30, 2004
- International Business Machines Corporation
- Duane E. Allen
- H01 - BASIC ELECTRIC ELEMENTS