Brian L. Carlson

Person

Rochester, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,595,416
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,390,439
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Brian L. Carlson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 9,942,990
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital processing equipment
- Patent number 9,873,132
- Issue date Jan 23, 2018
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- John Dangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of fabricating printed circuit board
- Patent number 9,648,723
- Issue date May 9, 2017
- International Business Machines Corporation
- Brian L. Carlson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing reduced drill smear
- Patent number 9,358,618
- Issue date Jun 7, 2016
- GLOBALFOUNDRIES Inc.
- Brian L. Carlson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20190254172
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Brian L. Carlson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20180103548
- Publication date Apr 12, 2018
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20170079133
- Publication date Mar 16, 2017
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FABRICATING PRINTED CIRCUIT BOARD
- Publication number 20170079131
- Publication date Mar 16, 2017
- International Business Machines Corporation
- Brian L. Carlson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Digital Processing Equipment
- Publication number 20160358830
- Publication date Dec 8, 2016
- LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- John Dangler
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
IMPLEMENTING REDUCED DRILL SMEAR
- Publication number 20150030402
- Publication date Jan 29, 2015
- International Business Machines Corporation
- Brian L. Carlson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Brian L. Carlson

Person

Patents Grantslast 30 patents

Insertion loss reduction and increased bonding in a circuit apparatus

Insertion loss reduction and increased bonding in a circuit apparatus

Insertion loss reduction and increased bonding in a circuit apparatus

Digital processing equipment

Process of fabricating printed circuit board

Implementing reduced drill smear

Patents Applicationslast 30 patents

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

PROCESS OF FABRICATING PRINTED CIRCUIT BOARD

Digital Processing Equipment

IMPLEMENTING REDUCED DRILL SMEAR