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Brian L. Singletary
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Austin, TX, US
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Patents Grants
last 30 patents
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Patent Grant
Fabrication method for circuit substrate having post-fed die side p...
Patent number
8,722,536
Issue date
May 13, 2014
International Business Machines Corporation
Daniel Douriet
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Automatic escalation/degradation of notifications of repetitive calls
Patent number
8,634,877
Issue date
Jan 21, 2014
International Business Machines Corporation
Fallon M. Delco
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Fabrication method for circuit substrate having post-fed die side p...
Patent number
8,586,476
Issue date
Nov 19, 2013
International Business Machines Corporation
Daniel Douriet
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit substrate having post-fed die side power supply connections
Patent number
7,863,724
Issue date
Jan 4, 2011
International Business Machines Corporation
Daniel Douriet
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System and method for noise reduction in multi-layer ceramic packages
Patent number
7,348,667
Issue date
Mar 25, 2008
International Business Machines Corporation
Sungjun Chun
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...
Publication number
20130316534
Publication date
Nov 28, 2013
International Business Machines Corporation
Daniel Douriet
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Automatic Escalation/Degradation of Notifications of Repetitive Calls
Publication number
20130267280
Publication date
Oct 10, 2013
International Business Machines Corporation
Fallon M. Delco
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...
Publication number
20100330797
Publication date
Dec 30, 2010
International Business Machines Corporation
Daniel Douriet
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit Substrate Having Post-Fed Die Side Power Supply Connections
Publication number
20090200074
Publication date
Aug 13, 2009
International Business Machines Corporation
Daniel Douriet
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
System and Method for Noise Reduction in Multi-Layer Ceramic Packages
Publication number
20070080436
Publication date
Apr 12, 2007
IBM CORPORATION
Sungjun Chun
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
System and method for noise reduction in multi-layer ceramic packages
Publication number
20060214190
Publication date
Sep 28, 2006
Sungjun Chun
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR