Brian Lynch

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer tab tape having distinct signal, power and ground plane...
- Patent number 6,171,888
- Issue date Jan 9, 2001
- LSI Logic Corp.
- Brian Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with on-chip ground base
- Patent number 5,892,272
- Issue date Apr 6, 1999
- LSI Logic Corporation
- Brian J. Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect bump for flip-chip integrated circuit including integr...
- Patent number 5,872,404
- Issue date Feb 16, 1999
- LSI Logic Corporation
- Brian Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer tape having distinct signal, power and ground planes, s...
- Patent number 5,763,952
- Issue date Jun 9, 1998
- LSI Logic Corporation
- Brian Lynch
- G01 - MEASURING TESTING
Information Patent Grant
Process for manufacturing an interconnect bump for flip-chip integr...
- Patent number 5,698,465
- Issue date Dec 16, 1997
- LSI Logic Corporation
- Brian Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a multi-layer tab tape semiconductor device
- Patent number 5,681,777
- Issue date Oct 28, 1997
- LSI Logic Corporation
- Brian Lynch
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit with on-chip ground plane
- Patent number 5,482,897
- Issue date Jan 9, 1996
- LSI Logic Corporation
- Brian J. Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making an interconnect bump for flip-chip integrated ci...
- Patent number 5,466,635
- Issue date Nov 14, 1995
- LSI Logic Corporation
- Brian Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cot/tab protective shipping apparatus and method
- Patent number 5,447,229
- Issue date Sep 5, 1995
- LSI Logic Corporation
- Brian Lynch
- H01 - BASIC ELECTRIC ELEMENTS

Brian Lynch

Person

Patents Grantslast 30 patents

Multi-layer tab tape having distinct signal, power and ground plane...

Integrated circuit with on-chip ground base

Interconnect bump for flip-chip integrated circuit including integr...

Multi-layer tape having distinct signal, power and ground planes, s...

Process for manufacturing an interconnect bump for flip-chip integr...

Process for manufacturing a multi-layer tab tape semiconductor device

Integrated circuit with on-chip ground plane

Process for making an interconnect bump for flip-chip integrated ci...

Cot/tab protective shipping apparatus and method